MCF5301x Development Kit | NXP Semiconductors

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MCF5301x Development Kit

M53017KIT アーカイブス
  • このページには、製造中止（生産終了）となった製品の情報が記載されています。本ページに記載されている仕様および情報は、過去の参考情報です。

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Digital Voice solution kit including an NRE free full software and hardware solution specifically designed for intercom and public address applications, also suitable for IP telephony. Includes Ethernet and WiFi connectivity.

製品詳細

対応製品

プロセッサ＆マイクロコントローラ

ColdFire® V3 Processors

  • MCF5301x: Low-Power MPU with dual Ethernet, USB, and audio sub-system

Features

Microprocessor

  • MCF53017CVMJ240J processor

Memory

  • 64 MB DDR-SDRAM
  • 32 MB NOR Flash
  • CAN Transceiver

Connectivity

  • Ethernet PHY or Dual PHY

Audio

  • Audio codec/amplifier

Wireless

  • Redpine Signals RS9110 WiFi SD card

Tools and OS Support

  • VoIP software
  • All licenses for VoIP software use
N true 0 TSPM53017KITja 5 アプリケーション・ノート Application Note t789 4 ファクト・シート Fact Sheet t523 1 ja ja ja アプリケーション・ノート Application Note 4 1 0 English Some of the high-end ColdFire products (such as the MCF532x, MCF537x, MCF5253, and MCF5445x devices) contain an EHCI-compatible host or dual-role/OTG USB controller. The dual-role module can be used as a USB host, a USB device, or as an On-the-Go device. When the dual-role module is used as a device, it uses data structures to control USB data movement. These data structures are similar in some ways to the embedded host controller interface (EHCI) data structures that are used when operating in host mode. 1205524500372727545151 TSP 173.2 KB None None documents None 1205524500372727545151 /docs/en/application-note/AN3631.pdf 173153 /docs/en/application-note/AN3631.pdf AN3631 documents N 2008-03-14 Simplified Device Data Structures for the High-End ColdFire<sup>&#174;</sup> Family USB Modules /docs/en/application-note/AN3631.pdf /docs/en/application-note/AN3631.pdf Application Note N 645036621402383989 2022-12-07 pdf en Mar 14, 2008 645036621402383989 Application Note Y N Simplified Device Data Structures for the High-End ColdFire<sup>&#174;</sup> Family USB Modules 2 1 English This document discusses the use of the split bus architecture implemented on the MCF5208, including an overview of the features and design considerations, as well as example block diagrams. 1117143692389726518657 TSP 97.1 KB None None documents None 1117143692389726518657 /docs/en/application-note/AN2982.pdf 97104 /docs/en/application-note/AN2982.pdf AN2982 documents N 2005-05-26 System Design Using the ColdFire<sup>&#174;</sup> MCF5208 Split Bus Architecture /docs/en/application-note/AN2982.pdf /docs/en/application-note/AN2982.pdf Application Note N 645036621402383989 2022-12-07 pdf en Feb 1, 2007 645036621402383989 Application Note Y N System Design Using the ColdFire<sup>&#174;</sup> MCF5208 Split Bus Architecture 3 0 English This document demonstrates how to determine the package temperature and thermal mass dependent moisture sensitivity level (MSL) of products to ensure reliable processing of moisture sensitive surface mount components. Comply with these recommendations to maintain package integrity of components during any heat exposure of board soldering and de-soldering. 1154542628855726115465 TSP 151.6 KB None None documents None 1154542628855726115465 /docs/en/application-note/AN3298.pdf 151612 /docs/en/application-note/AN3298.pdf AN3298 documents N N 2016-10-31 Solder Joint Temperature and Package Peak Temperature /docs/en/application-note/AN3298.pdf /docs/en/application-note/AN3298.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Aug 2, 2006 645036621402383989 Application Note Y N Solder Joint Temperature and Package Peak Temperature 4 0 English This document describes the Multimedia Card (MMC) and the Secure Digital (SD) modules on NXP Semiconductors i.MX application processors. This document gives an overview of the similarities and differences of both the MMC and SD protocols and cards including configuration of the MMC/SD module. The document also describes the interface of the MMC/SD modules, specifically the card identification mode and the system clock controller, along with example code. System considerations at various data trans 1129833053068723880793 TSP 619.4 KB None None documents None 1129833053068723880793 /docs/en/application-note/AN3049.pdf 619432 /docs/en/application-note/AN3049.pdf AN3049 documents N 2005-10-20 Setup and Use of the Multimedia Card and Secure Digital Host Controller /docs/en/application-note/AN3049.pdf /docs/en/application-note/AN3049.pdf Application Note N 645036621402383989 2022-12-07 pdf en Oct 20, 2005 645036621402383989 Application Note Y N Setup and Use of the Multimedia Card and Secure Digital Host Controller ファクト・シート Fact Sheet 1 5 2.1 English The uC5317 is a highly integrated system level solution for development of tow way voice. 1266261397702686724270 TSP 1.3 MB None None documents None 1266261397702686724270 /docs/en/fact-sheet/uC53017FS.pdf 1290454 /docs/en/fact-sheet/uC53017FS.pdf UC53017FS documents N N 2016-10-31 uC53017-EVM embedded voice module. /docs/en/fact-sheet/uC53017FS.pdf /docs/en/fact-sheet/uC53017FS.pdf Fact Sheet N 736675474163315314 2022-12-07 pdf N en Feb 15, 2010 736675474163315314 Fact Sheet Y N uC53017-EVM embedded voice module. false 0 M53017KIT downloads ja true 0 Y TSP アプリケーション・ノート 4 /docs/en/application-note/AN3631.pdf 2008-03-14 1205524500372727545151 TSP 1 Mar 14, 2008 Application Note Some of the high-end ColdFire products (such as the MCF532x, MCF537x, MCF5253, and MCF5445x devices) contain an EHCI-compatible host or dual-role/OTG USB controller. The dual-role module can be used as a USB host, a USB device, or as an On-the-Go device. When the dual-role module is used as a device, it uses data structures to control USB data movement. These data structures are similar in some ways to the embedded host controller interface (EHCI) data structures that are used when operating in host mode. None /docs/en/application-note/AN3631.pdf English documents 173153 None 645036621402383989 2022-12-07 /docs/en/application-note/AN3631.pdf Simplified Device Data Structures for the High-End ColdFire<sup>&#174;</sup> Family USB Modules /docs/en/application-note/AN3631.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N Simplified Device Data Structures for the High-End ColdFire<sup>&#174;</sup> Family USB Modules 173.2 KB AN3631 N 1205524500372727545151 /docs/en/application-note/AN2982.pdf 2005-05-26 1117143692389726518657 TSP 2 Feb 1, 2007 Application Note This document discusses the use of the split bus architecture implemented on the MCF5208, including an overview of the features and design considerations, as well as example block diagrams. None /docs/en/application-note/AN2982.pdf English documents 97104 None 645036621402383989 2022-12-07 /docs/en/application-note/AN2982.pdf System Design Using the ColdFire<sup>&#174;</sup> MCF5208 Split Bus Architecture /docs/en/application-note/AN2982.pdf documents 645036621402383989 Application Note N en None Y pdf 1 N System Design Using the ColdFire<sup>&#174;</sup> MCF5208 Split Bus Architecture 97.1 KB AN2982 N 1117143692389726518657 /docs/en/application-note/AN3298.pdf 2016-10-31 1154542628855726115465 TSP 3 Aug 2, 2006 Application Note This document demonstrates how to determine the package temperature and thermal mass dependent moisture sensitivity level (MSL) of products to ensure reliable processing of moisture sensitive surface mount components. Comply with these recommendations to maintain package integrity of components during any heat exposure of board soldering and de-soldering. None /docs/en/application-note/AN3298.pdf English documents 151612 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN3298.pdf Solder Joint Temperature and Package Peak Temperature /docs/en/application-note/AN3298.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N Solder Joint Temperature and Package Peak Temperature 151.6 KB AN3298 N 1154542628855726115465 /docs/en/application-note/AN3049.pdf 2005-10-20 1129833053068723880793 TSP 4 Oct 20, 2005 Application Note This document describes the Multimedia Card (MMC) and the Secure Digital (SD) modules on NXP Semiconductors i.MX application processors. This document gives an overview of the similarities and differences of both the MMC and SD protocols and cards including configuration of the MMC/SD module. The document also describes the interface of the MMC/SD modules, specifically the card identification mode and the system clock controller, along with example code. System considerations at various data trans None /docs/en/application-note/AN3049.pdf English documents 619432 None 645036621402383989 2022-12-07 /docs/en/application-note/AN3049.pdf Setup and Use of the Multimedia Card and Secure Digital Host Controller /docs/en/application-note/AN3049.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N Setup and Use of the Multimedia Card and Secure Digital Host Controller 619.4 KB AN3049 N 1129833053068723880793 ファクト・シート 1 /docs/en/fact-sheet/uC53017FS.pdf 2016-10-31 1266261397702686724270 TSP 5 Feb 15, 2010 Fact Sheet The uC5317 is a highly integrated system level solution for development of tow way voice. None /docs/en/fact-sheet/uC53017FS.pdf English documents 1290454 None 736675474163315314 2022-12-07 N /docs/en/fact-sheet/uC53017FS.pdf uC53017-EVM embedded voice module. /docs/en/fact-sheet/uC53017FS.pdf documents 736675474163315314 Fact Sheet N en None Y pdf 2.1 N N uC53017-EVM embedded voice module. 1.3 MB UC53017FS N 1266261397702686724270 true Y Tools

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アプリケーション・ノート (4)
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