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PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy
ISSUE DATE:24-Jun-2014
NOTIFICATION:16247
TITLE:MPC5643L TSMC14 PRIMARY WAFER FAB SITE TRANSFER
EFFECTIVE DATE:22-Dec-2014

DEVICE(S)
MPN
SPC5643LF2MLQ1
SPC5643LF2MLQ1R
SPC5643LF2MLQ8
SPC5643LF2MLQ8R
SPC5643LF2VLQ8
SPC5643LFF2MLL6
SPC5643LFF2MLQ1
SPC5643LFF2MLQ1R
SPC5643LFK0MLQ1
SPC5643LFK0MLQ1R

AFFECTED CHANGE CATEGORIES
  • BILL OF MATERIAL CHANGE (SAME ASSEMBLY SITE)

  • FAB SITE


    • DESCRIPTION OF CHANGE

    To meet the increasing demand for MPC5643L, Freescale is announcing the introduction of Taiwan Semiconductor Manufacturing Company Fab 14 (TSMC14), Tainan, Taiwan as primary wafer manufacturing location for this family.   TSMC14 has been qualified with Copper wirebond material.

     Approval of GPCN and backlog conversion to TSMC14 is required in order to allow deliveries by the first week of January.

     

    Key Dates
    Pre Alert Issued   29-May-14
    Approval 180 Days 25-Nov-14
     TSMC14 Deliveries 45 Days 9-Jan-15
     
    If customer is unable to approve TSMC14 per the table above, allocation of ATMC material will begin first week of January.
       

    WAFER FAB

    ASSEMBLY SITES

    PACKAGE TYPE

    WIRE

    Current Mold Compound

    New Mold Compound

    TSMC 14

    FSL-KLM-FM

    100/144LQFP

    PdCu 20um

    N/A

    SUMITOMO EME-G700SLS
     
     
    To standardize and aid manufacturing flexibility, a change from Gold to Copper Wire has already been qualified for Austin Technology Manufacturing Center (ATMC), Austin, USA sourced material (PCN15947). 



    REASON FOR CHANGE

    The primary wafer manufacturing site transfer to TSMC14  will improve Freescale’s ability to meet increasing customer demand, while still maintaining the ability to provide backup supply from the original Fab (ATMC) in case of emergency or demand surges.

     



    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

    There will be no impact to form, fit, function or reliability. Reliability will be equivalent or improved.



    According to JEDEC Standard JESD46, lack of acknowledgement of this PCN within 30 days will be considered acceptance of change. To request further data or inquire about the notification, please enter a Service Request.

    For sample inquiries - please go to www.freescale.com


    RELATED NOTIFICATION(S):
    P16247 - PRE ALERT: MPC5643L TSMC14 PRIMARY WAFER FAB SITE TRANSFER

    TO VIEW the GENERIC copy, click on the notification number above.
    QUAL DATA AVAILABILITY DATE:     09-May-2014

    QUALIFICATION STATUS:     COMPLETED

    QUALIFICATION PLAN:

    Freescale Transfer of Qualified Processes specification for Fab Qualifications were followed.



    RELIABILITY DATA SUMMARY:

    See attached qualification results.



    ELECTRICAL CHARACTERISTIC SUMMARY:

    No change will be made to the operating performance of the device. No change to datasheet. Electrical Distribution enclosed.  EMC reports available upon request.  



    CHANGED PART IDENTIFICATION:

    Table below provides sample part numbers: 

     

    Package Type

    TSMC14 Sample Part Numbers

    ATMC Equivalent

    100LQFP

    KPC5643LFK0MLL6

    SPC5643LFF2 t LL6

    100LQFP

    KPC5643LFK0MLL6R

    SPC5643LFF2 t LL6R

    t = Temp range (M, V, C)

    144LQFP

    KPC5643LFK0MLQ1

    SPC5643L f F2 t LQ s

    s = Speed (8=80MHz, 1=120MHz)

    144LQFP

    KPC5643LFK0MLQ1R

    SPC5643L f F2 t LQ s R

    f = 64k data flash, no f = no data flash
       

    F2 = ATMC rev2 = K0 = TSMC14 rev0

    		  



    SAMPLE AVAILABILITY DATE: 25-Jun-2014


    ATTACHMENT(S):
    External attachment(s) FOR this notification can be viewed AT:
    16247_Leopard_TSMC_N18H_Cu_Wire_vs_ATMC_N89D_Au_Wire_Electrical_Distribution_PCN16247.pdf
    16247_Leopard_N18H_144LQFP_TSMC_Cu_Vs_ATMC_Au_Electrical_Distribution_Report_PCN16247.pdf
    16247_PCN16247_Leopard_FL_TSMC14_Cu_Official_Qual_Result.pdf