Semiconductor Products Sector
Issuing Division: ADVANCED VEHICLE SYS DIV (JB)

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PRODUCT BULLETIN
Generic Copy

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14-AUG-2002

NAME:                  GPCN-SPS DISTRIBUTION-LIST 
EMAIL ADDRESS:         GPCNDIS1@email.sps.mot.com 
Subject:               MOTOROLA PRODUCT BULLETIN 7915 
TITLE: 
  MCF5206 QUALIFICATION AT MOS11 

EFFECTIVE DATE:        15-Aug-2002 


AFFECTED CHANGE CATEGORIES 

a.. MOTOROLA FAB SITE 


AFFECTED PRODUCT DIVISIONS 

a.. WIRELESS COMMUNICATIONS DIV (VC) 
b.. ADVANCED VEHICLE SYS DIV (JB) 
c.. WIRELESS INFRASTRCT SYS DIV (NH 
d.. BODY ELECT, OCCUPANT SAFETY (JD 
e.. RF/IF DIV (VW) 
f.. CPD- COMPUTING PLATFORM DIVISION (NR) 
g.. SMARTMOS PROD TECH CTR (JS 
h.. DRIVER INFORMATION DIVISION (JI) 
i.. NETWORK & COMM SYS DIV (NB) 
j.. BRD. AND ENT. DIVISION BESD (VE) 

ADDITIONAL RELIABILITY DATA: None 
REFERENCE: Contact Sales Office () 

SAMPLES: Contact Local Sales Office 
REFERENCE: Contact Sales Office () 
  Contact your local Motorola Sales Office. 

For any questions concerning this notification: 
REFERENCE: Contact Sales Office (CHRISTY MALLINGER) 

DISCLAIMER 
      DISCLAIMER: 
      
      MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS 
      OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL 
      MOTOROLA SALES OFFICE. 

DESCRIPTION AND PURPOSE 

      Motorola is pleased to announce the successful qualification of the 
      MCF5206 transferred to our MOS11 wafer fabrication facility in 
      Austin, Texas, as a result of the closure of the TSC8 wafer 
      fabrication facility in Sendai, Japan. This transfer allows for 
      continued customer support of this product. 
      
      This transfer was originally announced in GPCN#7258 published 
      01MAR02. Qualification results are included. 
      
      REFERENCE PREVIOUS PCN NUMBER: 
      7258 - TRANSFER PRODUCTS FROM TSC8 

QUALIFICATION PLAN 

      1-Lot of HTOL at 125oC for 96hrs 
      
      Bond Pull Strength 
      Bond Shear Test 
      ESD HBM at 2000kV, MM at 200V 
      Static Latch Up 25oC, 200mA 
      3-Lots of ELFR 125oC, 48hrs 

RELIABILITY DATA SUMMARY 

      1-Lot of HTOL at 125oC for 96hrs - 0/77 
      
      Bond Pull Strength - 0/5, Cpk = 2.92 
      Bond Shear Test - 0/5, Cpk = 1.91 
      ESD HBM at 2000kV, MM at 200V - 0/3 for both HBM and MM 
      Static Latch Up 25oC, 200mA - 0/6 
      3-Lots of ELFR 125oC, 48hrs - Lot 1 - 1/799(see A), Lot 2 - 
      1/800(see B), 
      Lot 3 - 0/799 
      
      (A)Memory Failure - FA found no abnormalities 
      (B)Opens Failure - FA found no abnormalities 
      
      PPM at 60 percent UCL is 1295. 
      
      Full Qualification Report is Available Upon Request 

CHANGED PART IDENTIFICATION 

      All new product shipped from MOS11 will have the MOS11 mask set of 
      L73M in the marking. 


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RELATED NOTIFICATIONS: 

  TRANSFER PRODUCTS FROM TSC8 
AFFECTED DEVICE LIST PART 
      MCF5206CFT16A 
      MCF5206CFT25A 
      MCF5206FT16 
      MCF5206FT16A 
      MCF5206FT25 
      MCF5206FT25A 
      MCF5206FT25AB1 
      MCF5206FT25B1 
      MCF5206FT33 
      MCF5206FT33A 
      PCF5206CFT16B 
      PCF5206CFT25B 
      PCF5206FT16B 
      PCF5206FT25B 
      PCF5206FT33B 
      SPAK5206FT16A 
      SPAK5206FT25 
      SPAK5206FT25A 
      SPAK5206FT33A 
      XCF5206FT16 
      XCF5206FT25 
      XCF5206FT25B1 
      XCF5206FT33