201702014F01 : Introduction of Powerchip as an additional wafer fab source for MIFARE Classic EV1
Installation of Powerchip as an additional wafer fab for capacity enhancements to the already existing wafer fab source TSMC. The copy exact concept is applied to install the existing process at Powerchip. Powerchip will operate under the same conditions at equal performance and with comparable systems processes and equipment. The affected products are currently delivered in contactless modules using TSMC wafer fab. As a consequence of the present change an additional wafer supplier is qualified. Each reel of modules delivered by NXP contains only one source of wafer fab. However for commercial deliveries containing more than one reel different reels may contain different sources of wafer fab.
| PCNタイプ | カテゴリー変更 | 発行日 | 有効期限 |
|---|---|---|---|
| Final Product Change Notification | Wafer fab location | 13-Feb-2017 | 14-May-2017 |
変更理由
The implementation of this second source will increase production capacity and flexibility.
対象製品の特定について
Product identification does not change Products from current wafer fabs and Powerchip will have the same ordering code (12NC).
予想される影響
データシートの改訂: No impact to existing datasheet
No impact to the product's functionality.No impact on form fit function reliability or quality.
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
MF1S5000XDA4/V1J (935302816118) |
- | - | None |
|
MF1S5000XDA8/V1J (935302824118) |
- | - | None |
|
MF1S5030XDA4/V1J (935302818118) |
- | - | None |
|
MF1S5030XDA8/V1J (935302825118) |
- | - | None |