201705011F01 : NX5P3090UK Bumping Site transfer from ChipBond to ASEK
NXP is pleased to announce product assembly migration from Chipbond to ASEK. Bumping process is same "repassivation + plated UBM + ball drop" But the bumping/assemble center change to ASEK. The Bumping process in ASEK has been released in 2016. Specific qualification tests for bumping transfer has been done on NX5P3090UK parts and all pass.old product flow: SSMC(fab) -> Chip-bond (bumping) -> ATKH (WT) -> Chip-bond (assembly)new product flow: SSMC(fab) -> ASEK (bumping) -> ATKH (WT) -> ASEK(assembly)
| PCNタイプ | カテゴリー変更 | 発行日 | 有効期限 |
|---|---|---|---|
| Final Product Change Notification | Assembly location | 23-Jul-2017 | 21-Oct-2017 |
変更理由
Chipbond old site closure on end Q2 2017ASEK new site production start wk1714
対象製品の特定について
Top side marking Top side Marking on Chipbond material is '5' while ASE-K is 't'.
予想される影響
データシートの改訂: No impact to existing datasheet
no impactNo impact on form fit function reliability or quality.
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
NX5P3090UKZ (935305702012) |
- | - | - |