201707002F01 : MCF5225X Fab Site Expansion (TSMC3 to NXP-CHD)
NXP Semiconductors is announcing the qualification of the NXP Chandler Arizona USA (NXP-CHD) wafer fabrication facility as a dual source wafer manufacturing location for the MCF5225X.The current mask set for product sourced out of TSMC3 Fab is identified as 1M42N.The new mask set for product sourced out of NXP-CHD Fab is identified as 0N18K.
| PCNタイプ | カテゴリー変更 | 発行日 | 有効期限 |
|---|---|---|---|
| Final Product Change Notification | Wafer fab location | 24-Aug-2017 | 21-Nov-2017 |
変更理由
The Fab manufacturing site capacity expansion to NXP-CHD will improve NXP's ability to meet increasing customer demand and maintain supply.
対象製品の特定について
Top side marking The mask set marking for product sourced out of TSMC3 Fab is 1M42N. The mask set marking for product sourced out of NXP-CHD Fab is 0N18K.
予想される影響
データシートの改訂: No impact to existing datasheet
There is no change to product form fit function or reliability.
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
MCF52252AF80 (935309314557) |
- | - | - |
|
MCF52252CAF66 (935309315557) |
- | - | - |
|
MCF52254AF80 (935309316557) |
- | - | - |
|
MCF52254CAF66 (935322567557) |
- | - | - |
|
MCF52255CAF80 (935309317557) |
- | - | - |
|
MCF52256AG80 (935310011557) |
- | - | - |
|
MCF52256CAG66 (935321329557) |
- | - | - |
|
MCF52256CVN66 (935313986557) |
- | - | - |
|
MCF52258AG80 (935317009557) |
- | - | - |
|
MCF52258CAG66 (935314016557) |
- | - | - |
|
MCF52258CVN66 (935313987557) |
- | - | - |
|
MCF52258CVN66J (935324336557) |
- | - | - |
|
MCF52258VN80 (935313988557) |
- | - | - |
|
MCF52259CAG80 (935309895557) |
- | - | - |
|
MCF52259CVN80 (935319401557) |
- | - | - |
|
MCF52264AF80 (935323051557) |
- | - | - |