201708001I : UCODE 7 12inch - Change of wafer map origin coordinates

Standardization of origin of coordinates in NXP manufacturing sitesDuring UCODE7 12inch ramp-up origin of coordinates have been placed at wafer center which is not according to NXP standard. Reason: at ramp-up start in August 2016 not all manufacturing tools could handle row & column count > 512 Impact: positive and negative coordinates in wafer maps.Current status: all manufacturing tools are upgraded to handle row & column count > 512 which allows to place the origin from wafer center outside the wafer according to NXP standard. Impact: only positive coordinates in wafer maps.In addition to this standardization the wafer layout has been optimized to increase NDPW.

変更理由

Standardization of origin of coordinates in NXP manufacturing sites.

対象製品の特定について

Product identification does not change

予想される影響

データシートの改訂: No impact to existing datasheet

No impact on form fit function reliability or quality.

対象品番