201708003F02 : MMA865x ASECL Transfer and Copper Wire Qualification

NXP Semiconductors announces the completion of the consumer level qualification of the ASE-Chungli Taiwan (ASECL) assembled MMA8652FCR1 and MMA8653FCR1 products. NXP Semiconductors ASE-Chungli Taiwan (ASECL) assembled MMA8652 and MMA8653 products are qualified with the materials change to Gold Palladium Copper (AuPdCu) wire Sumitomo EME-G700LA mold compound and Ablestik die attach film ATB-125/ATB-125HA2. These products were previously assembled with Gold (Au) wire Sumitomo EME-G700 mold compound and Henkel ATB-120A DAF die attach material.Reliability qualification and full electrical characterization over temperature has been completed. There is no change to thermal behavior or mechanical dimensions. Electrical parameters remain unchanged (within specification and with no changes to distributions).

変更理由

The transfer to ASECL is for supply continuity as a result of ATK1 closure. The transfer from Gold to Gold Palladium Copper wire is an alignment to industry standard convention for wirebond material type. The change to mold compound and die attach material for DFN 2x2 package is required to standardize the bill of materials for ASECL assembly production.

対象製品の特定について

Product identification does not change There is no change to the orderable part numbers. NXP will have traceability of the assembly site by the 2nd digit of the tracecode.

予想される影響

データシートの改訂: No impact to existing datasheet

No impact to product form fit function or reliability.No impact on form fit function reliability or quality.

対象品番