201712015A : FXLN83xx ASECL Transfer and Copper Wire Qualification

NXP Semiconductors announces the assembly transfer of FXLN8361 FXLN8362 FXLN8371 and FXLN8372 to ASE-ChungLi Taiwan (ASECL) assembly site. These products were previously assembled at the Amkor Korea (ATK1) assembly site.NXP Semiconductors ASE-Chungli Taiwan (ASECL) assembled FXLN8361 FXLN8362 FXLN8371 and FXLN8372 products are qualified with the materials change to Gold Palladium Copper (AuPdCu) wire Sumitomo EME-G700LA version P mold compound and Ablestik die attach film ATB-125. These products were previously assembled with Gold (Au) wire Sumitomo EME-G700 mold compound and Henkel ATB-F125E DAF die attach film material. Qualification data will be available after qualification completion in March 2018.

変更理由

The transfer to ASECL is for supply continuity as a result of ATK1 closure. The transfer from Gold to Gold Palladium Copper wire is an alignment to industry standard convention for wirebond material type. The change to mold compound and die attach material for QFN 3x3 package is required to standardize the bill of materials for ASECL assembly production.

対象製品の特定について

Product identification does not change There is no change to the orderable part numbers. NXP will have traceability of the assembly site by the 2nd digit of the tracecode.

予想される影響

データシートの改訂: No impact to existing datasheet

No impact on form fit function reliability or quality.

タイミングとロジスティックス

The Final PCN is planned to be issued on 30-Mar-2018

対象品番