201803021F01 : MPC8245 and MPC8250/8255/8260/8265 TBGA Product Family Conversion to Center Gate Mold Process

NXP is pleased to announce a new encapsulation process called Center Gate Mold for the TBGA package variants of the MPC8245 and MPC8250/8255/8260/8265 product families.Currently the encapsulation process used on the TBGA package variants of the MPC8245 and MPC8250/8255/8260/8265 product family is the Fine Pitch Glob process. For supply assurance NXP is adding the Center Gate Mold process to these product families.Due to the nature of the Center Gate Mold (injection mold) process the current Dexter FP4451 Dam and Nagase T693/R1001 Glob Filter epoxy will be replaced by the Sumitomo G770SFL Ultra Low Alpha Mold Compound used in established Center Gate Mold products.

変更理由

As part of NXP's continuous improvement efforts this change is being made to support customer supply assurance.

対象製品の特定について

Product identification does not change

予想される影響

データシートの改訂: No impact to existing datasheet

No impact to Form Fit Function or Reliability.Case outline spec is maintained while providing a more dimensionally uniform product. This will be observed as a flatter surface with uniform color.No impact on form fit function reliability or quality.

対象品番