201808025F01 : IMPROVED PASSIVE COMPONENT ATTACH MATERIAL FOR TO270WB PACKAGES
NXP announces a change from silver filled epoxy to a sintered silver die attach for passive components in TO270WB packages. Sintered silver is a widely accepted die attach material for power devices with superior thermal and electrical properties and significantly increases the adhesion strength of the bond between passive component and heatsink. Datasheet Functional Table RF performance specifications remains unchanged. If you have any questions or require additional information please contact your local NXP sales office or NXP approved distributor.
| PCNタイプ | カテゴリー変更 | 発行日 | 有効期限 |
|---|---|---|---|
| Final Product Change Notification | Assembly materials | 22-Feb-2019 | 22-May-2019 |
変更理由
Die attach material standardization and improved die attach bond strength.
対象製品の特定について
Device marking will not change.
予想される影響
データシートの改訂: No impact to existing datasheet
No impact on form fit function reliability or quality.
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
A2I20D020GNR1 (935313109528) |
- | - | - |
|
A2I20D020NR1 (935313237528) |
- | - | - |
|
A2I20D040GNR1 (935316286528) |
- | - | - |
|
A2I20D040NR1 (935316291528) |
- | - | - |
|
A2I22D050NR1 (935312142528) |
- | - | - |
|
A2I25D025GNR1 (935323756528) |
- | - | - |
|
A2I25D025NR1 (935315964528) |
- | - | - |
|
A2I25H060GNR1 (935316196528) |
- | - | - |
|
A2I25H060NR1 (935322312528) |
- | - | - |
|
A2I35H060NR1 (935322497528) |
- | - | - |
|
A2T09VD250NR1 (935320819528) |
- | - | - |
|
A2T09VD300NR1 (935316219528) |
- | - | - |
|
AFIC31025GNR1 (935343961528) |
- | - | - |
|
AFIC31025NR1 (935343962528) |
- | - | - |