201903005F01W : Withdrawal: ASEK Grinding/Sawing Transferring to ATKH - NX20P5090UK WITHDRAWAL
Expanding the current flow which is currently limited to an ASE Assembly to allow for ATKH BE2 (back half of the Assembly process). The flow allows for manufacturing flexibility and helps ensure customer supply. BE2(back half of the Assembly process) (grinding/sawing/marking and Packing) will be enabled in ATKH. There's no change in Form Fit or Function.
| PCNタイプ | カテゴリー変更 | 発行日 | 有効期限 |
|---|---|---|---|
| Final Product Change Notification | Other | 13-May-2022 | 11-Aug-2022 |
変更理由
Expanding the current flow which is currently limited to an ASE Assembly to allow for ATKH BE2. The flow allows for manufacturing flexibility and helps ensure customer supply.
アップデート情報
NXP decided to stop the NX20P5090 BE2 expansion because the current ASEK has enough capacity to support customer demands.
予想される影響
データシートの改訂: No impact to existing datasheet
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
NX20P5090UKAZ (935305697041) |
- | - | - |