201907020F01:i.MX6ULL Fab Site Transfer from SMIC8 to SMICB2
  • 製品変更通知 (PCN)
  • 201907020F01

201907020F01 : i.MX6ULL Fab Site Transfer from SMIC8 to SMICB2

NXP Semiconductors announces the Wafer Fabrication site transfer for i.MX6ULL associated with this notification from the current SMIC8 Shanghai China Wafer Fabrication site to the SMICB2 Beijing China Wafer Fabrication site. Wafer Fabrication site transfer was successfully qualified adhering to NXP specifications. Corresponding ZVEI Delta Qualification Matrix ID: SEM-PW-13

PCNタイプ カテゴリー変更 発行日 有効期限
Final Product Change Notification Wafer fab location 16-Aug-2019 13-Nov-2019

変更理由

SMIC8 wafer Fabrication site will cease production for 40nm technology production line and need transfer the products to internal SMICB2 Wafer Fabrication site.Qualification of SMICB2 Wafer Fabrication site is required for customer supply assurance.

対象製品の特定について

Product identification does not change There is no change to orderable part number. The tracecode marking on the device includes datecode. NXP will have traceability by datecode.

予想される影響

Equivalent wafer fabrication process currently used at SMIC8 wafer manufacturing facility will be implemented at SMICB2.No impact on form fit function reliability or quality.

対象品番

品番/12NC 最終購入日 最終納品日 交換品番
MCIMX6Y0CVM05AB
(935357241557)
- - -
MCIMX6Y0DVM05AB
(935357242557)
- - -
MCIMX6Y1CVK05AB
(935357243557)
- - -
MCIMX6Y1CVM05AB
(935354638557)
- - -
MCIMX6Y1DVK05AB
(935357244557)
- - -
MCIMX6Y1DVM05AB
(935357245557)
- - -
MCIMX6Y2CVK08AB
(935357246557)
- - -
MCIMX6Y2CVM05AB
(935357247557)
- - -
MCIMX6Y2CVM05ABR
(935357247518)
- - -
MCIMX6Y2CVM08AB
(935357248557)
- - -
MCIMX6Y2DVK09AB
(935357249557)
- - -
MCIMX6Y2DVM05AB
(935357251557)
- - -
MCIMX6Y2DVM09AB
(935357252557)
- - -
MCIMX6Y7DVK05AB
(935357253557)
- - -
MCIMX6Y7DVM09AB
(935357254557)
- - -
MCIMX6Z0DVM09AB
(935377904557)
- - -