201909001A : XSON6 (SOT886) Assembly/Test Transfer from ATGD and ATSN to ATBK
NXP Semiconductors is transferring assembly and test of the SOT886 (XSON6) package from ATSN and ATGD to ATBK. Standard ATBK BOM and flows will be used.Product data sheets will be updated with new orderable part numbers to reflect the use of Static Shielding Bags (SSB). Orderable Part #s/12NC will be included in update of Final PCN.
| PCNタイプ | カテゴリー変更 | 発行日 |
|---|---|---|
| Advanced Product Change Notification | Assembly location, Assembly materials, Assembly process, Packing/Shipping/Labeling, Test equipment, Test location | 16-Sep-2019 |
変更理由
Move production to an NXP facility to assure product quality and delivery.
対象製品の特定について
Packing Labels will show Product Manufacturing Code (PMC) "n" to reflect ATBK assembly.
予想される影響
データシートの改訂: A new datasheet will be issued
No impact on form fit function reliability or quality.
タイミングとロジスティックス
The Final PCN is planned to be issued on 20-Sep-2019
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
NCX2200GM,115 (935294048115) |
- | - | - |
|
NX3L1G3157GM,115 (935284122115) |
- | - | - |
|
NX3L1G384GM,115 (935285982115) |
- | - | - |
|
NX3L1T3157GM,115 (935285418115) |
- | - | - |
|
NX3L1T5157GM,115 (935287633115) |
- | - | - |