201909001F02 : XSON6 (SOT886) Assembly/Test Transfer from ATGD and ATSN to ATBK

NXP Semiconductors is transferring assembly and test of the SOT886 (XSON6) package from ATSN and ATGD to ATBK. This will mitigate supply continuity concerns with ATSN (currently on lockdown) and ATGD during the COVID-19 crisis. There are no changes to the die and packing orientation. Standard ATBK materials and flows will be used including a roughened leadframe to improve package delamination performance. Please refer to the attached qualification report for detail. Product data sheets have been updated with new orderable part numbers to reflect the use of Static Shielding Bags (SSB). Although the planned first shipment is 90 days from notification customer may request product delivery sooner and NXP will provide as available.

PCNタイプ	カテゴリー変更	発行日	有効期限
Final Product Change Notification	Assembly location, Assembly materials, Assembly process, Packing/Shipping/Labeling, Test equipment, Test location	27-Apr-2020	26-Jul-2020

変更理由

Move production to an NXP facility to improve product quality and to assure product delivery especially during the COVID -19 crisis.

対象製品の特定について

Packing Labels will show Product Manufacturing Code (PMC) "n" to reflect ATBK assembly.

予想される影響

データシートの改訂: A new datasheet will be issued

No impact on form fit function reliability or quality.

対象品番

品番／12NC	最終購入日	最終納品日	交換品番
NX3L1G3157GM,115 (935284122115)	-	-	NX3L1G3157GMZ (935284122471)