201912009F01:i.MXRT106A FAB Site Transfer from SMIC8 to SMICB2
  • 製品変更通知 (PCN)
  • 201912009F01

201912009F01 : i.MXRT106A FAB Site Transfer from SMIC8 to SMICB2

NXP Semiconductors announces the Wafer Fabrication site transfer for i.MXRT106A from the current SMIC8 Shanghai China Wafer Fabrication site to the SMICB2 Beijing China Wafer Fabrication site.Wafer Fabrication site transfer was successfully qualified adhering to NXP specifications.

PCNタイプ カテゴリー変更 発行日 有効期限
Final Product Change Notification Wafer fab location 22-Dec-2019 21-Mar-2020

変更理由

SMIC8 wafer Fabrication site will cease production for 40nm technology and therefore NXP is moving production of i.MXRT106A to internal SMICB2 Wafer Fabrication site.Qualification of SMICB2 Wafer Fabrication site is required for customer supply assurance.

対象製品の特定について

There is no change to orderable part number. NXP will have traceability by ECID

予想される影響

No impact on form fit function reliability or quality.

対象品番

品番/12NC 最終購入日 最終納品日 交換品番
MIMXRT106ADVL6A
(935385521557)
- - -
MIMXRT106ADVL6AR
(935385521518)
- - -
MIMXRT106FDVL6A
(935389817557)
- - -
MIMXRT106LDVL6A
(935389818557)
- - -