202002004F01 : SAC57D54H/53M/52L Die Thickness Increase to 280um For The 516MAPBGA 27*27
NXP Semiconductors announces a change in die thickness for the SAC57D54H/ 53M/ 52L Mask Set N87P from the current 179um to 280um.The above change coincides with DeQuMa ID: SEM-PW-03.
| PCNタイプ | カテゴリー変更 | 発行日 | 有効期限 |
|---|---|---|---|
| Final Product Change Notification | Assembly process | 12-Mar-2020 | 10-Jun-2020 |
変更理由
Die thickness increase is to improve product quality reliability and C55 product family standardization.
対象製品の特定について
Product identification does not change
予想される影響
No impact on form fit function reliability or quality.
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
SAC57D53MCVMO (935318864557) |
- | - | - |
|
SAC57D53MCVMOR (935318864518) |
- | - | - |
|
SAC57D54HCVMO (935313269557) |
- | - | - |
|
SAC57D54HCVMOR (935313269518) |
- | - | - |