202103036F01 : TSSOP8 (SOT505-1) Assembly Expansion in ATBK and Manufacturing Alignment

NXP is expanding ATBK assembly capabilities to include the part types in the attached file list. Mold compound and die adhesive materials in the ATBK manufacturing process will use the standard EMC-7470L-Q and QMI519 materials respectively. Additionally ATBK will employ a roughened leadframe as a package quality improvement to reduce delamination. NXP has extensive manufacturing capabilities in the TSSOP8 family and with the critical demand for these products these changes will help with timely deliveries. It should be noted that the package offering utilized here will use a Roughened Leadframe solution. While the benefit of the solution is better adhesion of the mold compound (there have been no relevant customer returns).

変更理由

Due to increasing demand for SOT505-1 packaged devices NXP is adding the ATBK flow as an alternate source to help provide timely deliveries.

予想される影響

データシートの改訂: No impact to existing datasheet

対象品番