202303023F01 : I.MX31_Auto molding compound change from G770FL to G770SFL

NXP Semiconductors is announcing the successful qualification of molding compound change from G770FL to G770SFL (low alpha) for i.MX31 AUTO 19*19 BGA parts. G770SFL (low alpha) had better performance than G770FL on SER failure rate.        Corresponding ZVEI Delta Qualification Matrix ID: SEM-PA-11

変更理由

Molding compound change from G770FL to G770SFL (low alpha) will improve SER performance.        Molding compound G770FL and G770SFL (low alpha) have same composition. G770SFL (low alpha) molding compound has better control on alpha particle than G770FL

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