202404006F01 : Introduction of Plasma Dicing Capacity Extension for Plasma Diced UCODE 9
For the increase of production capacity we extend our plasma dicing location. • Next to our current plasma dicing site AMKOR (Taiwan) our plasma dicing subcontractor TFME (China) will be enabled. To be noted: • There will be no change in type names or 12NCs (ordering code) • TIDs will be not changed
| PCNタイプ | カテゴリー変更 | 発行日 | 有効期限 |
|---|---|---|---|
| Final Product Change Notification | Assembly location | 11-Apr-2024 | 10-Jul-2024 |
変更理由
NXP strives to provide larger flexibility in the production fulfilment. Being able to process UCODE 9 plasma diced wafer products at more than one source will increase capacity and supply stability.
予想される影響
データシートの改訂: No impact to existing datasheet
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
SL3S1206FUD2/HAPZ (935430457035) |
- | - | - |
|
SL3S1216FUD2/HAPAZ (935430459035) |
- | - | - |