Surface Mount to DIP Evaluation Board
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The OM13491 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13491 supports the following packages: SO8 (SOT96), VSSOP8 (SOT765), XQFN8 (SOT902), HWSON8 x 2 (SOT1069), MSOP8 x 2 (SOT505).
製品詳細
Features
Key Features
- Easy connection to small surface mount packages
- Allows evaluation of device that is only available in surface mount packages
- 100 mil center headers emulate DIP package for easy bread boarding
- Eliminates costly sockets and custom printed circuit boards
- Expand the kit with add-on I²C daughter cards