Surface Mount to DIP Evaluation Board
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OM13492 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13492 supports the following packages: MSOP10 (SOT552-1), HVSON10 (SOT650-1), XSON8U (SOT996-2), TSSOP8 (SOT530-1), HVSON8 (SOT908-1), WLCSP6 (PCT2202UK), and TSOP6 (SOT457, SOT1353-1).
製品詳細
Features
Connectivity
- Expand the kit with add-on I²C daughter cards
- Easy connection to small surface mount packages
Key Features
- Allows evaluation of device that is only available in surface mount packages
- 100 mil center headers emulate DIP package for easy bread boarding
- Eliminates costly sockets and custom printed circuit boards