Surface Mount to DIP Evaluation Board
- このページには、製造中止（生産終了）となった製品の情報が記載されています。本ページに記載されている仕様および情報は、過去の参考情報です。
OM13493 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13493 supports the following packages: DHVQFN24 (SOT616-1), DHVQFN20 (SOT662-1), DHVQFN16 (SOT763-1) and DHVQFN14 (SOT762-1).
製品詳細
Features
Connectivity
- Expand the kit with add-on I2C daughter cards
- Easy connection to small surface mount packages
Key Features
- Allows evaluation of device that is only available in surface mount packages
- 100 mil center headers emulate DIP package for easy bread boarding
- Eliminates costly sockets and custom printed circuit boards