Surface Mount to DIP Evaluation Board
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The OM13494 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13494 supports the following packages: HVQFN24 (SOT616), HVQFN20 (SOT662), HVQFN16 (SOT758), HVQFN14 (SOT629).
製品詳細
Features
Key Features
- 100 mil center headers emulate DIP package for easy bread boarding
- Allows evaluation of device that is only available in surface mount packages
- Eliminates costly sockets and custom printed circuit boards
Connectivity
- Easy connection to small surface mount packages
- Expand the kit with add-on I²C daughter cards