Surface Mount to DIP Evaluation Board
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The OM13495 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13495 supports the following packages: TSSOP24, (SOT355), TSSOP20, (SOT360), TSSOP16, (SOT403), TSSOP14, (SOT402).
製品詳細
Features
Key Features
- Allows evaluation of device that is only available in surface mount packages
- Eliminates costly sockets and custom printed circuit boards
- Expand the kit with add-on I²C daughter cards
- 100 mil center headers emulate DIP package for easy bread boarding
Connectivity
- Easy connection to small surface mount packages