MC13212 製品情報|NXP

特徴


SIP 802.15.4 2.4GHZ 32KB

パッケージ


HVLGA71: HVLGA71, plastic, thermal enhanced, very thin, low profile land grid array package; 71 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.9 mm body

購入オプション

操作機能

パラメータ
Security Status
COMPANY PUBLIC
Description
SIP 802.15.4 2.4GHZ 32KB
パラメータ
Number of pins
71
Package Style
HVLGA

環境

Part/12NC鉛フリーEU RoHSハロゲンフリーRHFインジケーターREACH SVHCWeight (mg)
MC13212(935313421557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
159.9
MC13212R2(935313421518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
159.9

品質

Part/12NC安全保障機能安全吸湿感度レベル (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
鉛フリーはんだ鉛フリーはんだ鉛フリーはんだ
MC13212
(935313421557)
No
3
250
30
MC13212R2
(935313421518)
No
3
250
30

配送

Part/12NC関税分類番号(米国)免責事項:輸出規制品目番号(米国)
MC13212
(935313421557)
854231
3A991A2
MC13212R2
(935313421518)
854231
3A991A2

製品変更のお知らせ

Part/12NC発行日有効期限PCNタイトル
MC13212
(935313421557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC13212R2
(935313421518)
MC13212
(935313421557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

詳細 MC13212

Archived content is no longer updated and is made available for historical reference only.

Please note that this product is not recommended for new designs.

The MC13212 System in Package (SiP) integrates the MC9S08GT MCU with the MC1320x transceiver into a single 9x9mm LGA package.  The MC13212 provides 32 K Flash memory and 2 K of RAM, providing an ideal platform for  applications that require a star network using the NXP® SMAC or IEEE 802015.4 Compliant PHY/MAC.