MF1S5010DA8 製品情報|NXP

購入オプション

MF1S5010DA8,118

製造中止

12NC: 935295142118

詳細

注文

操作機能

パラメータ
Security Status
COMPANY PUBLIC
Description
MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development
パラメータ
Number of pins
0
Package Style
PLLMC

環境

Part/12NC鉛フリーEU RoHSハロゲンフリーRHFインジケーターREACH SVHCWeight (mg)
MF1S5010DA8,118(935295142118)
Yes
Yes
No
GREACH SVHC
13.61930885

品質

Part/12NC安全保障機能安全
MF1S5010DA8,118
(935295142118)
No

配送

Part/12NC関税分類番号(米国)免責事項:輸出規制品目番号(米国)
MF1S5010DA8,118
(935295142118)
854232
5A992

製造終了品・代替品データ

Part/12NC製造終了のお知らせ最終購入日 最終納品日
MF1S5010DA8,118
(935295142118)
-
2005-06-30
2005-06-30

詳細 MF1S5010DA8

NXP has developed the MIFARE MF1ICS50 to be used in a contactless smart card according to ISO/IEC 14443 Type A.

The MIFARE MF1ICS50 IC is used in applications like public transport ticketing where major cities have adopted MIFARE as their e-ticketing solution of choice.

1.1 Key applications

  • Public transportation
  • Access control
  • Event ticketing
  • Gaming and identity

1.2 Anticollision

An intelligent anticollision function allows to operate more than one card in the field simultaneously. The anticollision algorithm selects each card individually and ensures that the execution of a transaction with a selected card is performed correctly without data corruption resulting from other cards in the field.

1.3 Simple integration and user convenience

The MF1ICS50 is designed for simple integration and user convenience. Which could allow complete ticketing transactions to be handled in less than 100 ms. Thus, the MF1ICS50 card user is not forced to stop at the reader leading to a high throughput at gates and reduced boarding times onto busses. The MIFARE card may also remain in the wallet during the transaction, even if there are coins in it.

1.4 Security

  • Mutual three pass authentication (ISO/IEC DIS 9798-2)
  • Individual set of two keys per sector (per application) to support multi-application with key hierarchy
  • Unique serial number for each device

1.5 Delivery options

  • Die on wafer
  • Bumped die on wafer
  • MOA4 or MOA2 contactless card module
  • Flip chip package
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