MF1S7035DA4 製品情報|NXP

購入オプション

MF1S7035DA4,118

製造中止

12NC: 935292972118

詳細

注文

操作機能

パラメータ
Number of pins
0
Package Style
PLLMC
Security Features
MIFARE CRYPTO1
Security Status
COMPANY PUBLIC
Random Number Generator
Y
ISO/IEC Support
ISO/IEC 14443-3
ISO/IEC 15693
ISO/IEC 14443-3
Description
MIFARE Classic 4K - Mainstream contactless smart card IC for fast and easy solution development
パラメータ
Delivery Type
MOA4
Standard
ISO/IEC 14443-3
Baud rate
106
UID Type
4-byte NUID
EEPROM Size
4096
Memory Organization
Sector Organization
Write Endurance
100000
Data Retention
10

環境

Part/12NC鉛フリーEU RoHSハロゲンフリーRHFインジケーターREACH SVHCWeight (mg)
MF1S7035DA4,118(935292972118)
Yes
Yes
No
GREACH SVHC
37.002613679999996

品質

Part/12NC安全保障機能安全
MF1S7035DA4,118
(935292972118)
No

配送

Part/12NC関税分類番号(米国)免責事項:輸出規制品目番号(米国)
MF1S7035DA4,118
(935292972118)
854232
5A992

製造終了品・代替品データ

Part/12NC製造終了のお知らせ最終購入日 最終納品日
MF1S7035DA4,118
(935292972118)
-
2005-03-31
2005-06-30

詳細 MF1S7035DA4

Archived content is no longer updated and is made available for historical reference only.

NXP® Semiconductors has developed the MIFARE® MF1S703x to be used in a contactless smart card according to ISO/IEC 14443 Type A.

The MIFARE MF1S703x IC is used in applications like public transport ticketing and can also be used for various other applications.

1.1 Anti-collision

An intelligent anti-collision function allows to operate more than one card in the field simultaneously. The anti-collision algorithm selects each card individually and ensures that the execution of a transaction with a selected card is performed correctly without interference from another card in the field.

1.2 Simple integration and user convenience

The MF1S703x is designed for simple integration and user convenience which allows complete ticketing transactions to be handled in less than 100 ms.

1.3 Security

  • Manufacturer programmed 4 byte Non-Unique IDentifier (NUID) for each device
  • Mutual three pass authentication (ISO/IEC DIS 9798-2)
  • Individual set of two keys per sector to support multi-application with key hierarchy

1.4 Delivery options

  • Die on wafer, bumped die on wafer
  • MOA4 contactless module
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