Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
パッケージ
BGA783: BGA783, plastic, ball grid array; 783 bumps; 1.0 mm pitch; 29 mm x 29 mm x 3.58 mm body
購入オプション
MSC8252TAG1000B
生産終了 (EOL)
12NC: 935317719557
詳細
注文
操作機能
| パラメータ | 値 |
|---|---|
Security Status | COMPANY PUBLIC |
Description | StarCore DSP, 2x 1GHz SC3850 cores, DDR2/3, SRIO, PCIe, QE, GbE, -40-105C |
| パラメータ | 値 |
|---|---|
Number of pins | 783 |
Package Style | BGA |
環境
| Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | 2次インターコネクト | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MSC8252TAG1000B(935317719557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e1 | REACH SVHC | 11142.7 |
品質
| Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 鉛フリーはんだ | 鉛フリーはんだ | 鉛フリーはんだ | |||||
MSC8252TAG1000B (935317719557) | No | 3 | 245 | 30 | |||
配送
| Part/12NC | 関税分類番号（米国)免責事項: | 輸出規制品目番号（米国） | 足跡 | キャプチャ・シンボル |
|---|---|---|---|---|
MSC8252TAG1000B (935317719557) | 854231 | 3A991A1 | PDF | Cadence Allegro(dra) | PDF | Orcad Capture 16.3(olb) |
製造終了品・代替品データ
| Part/12NC | 製造終了のお知らせ | 最終購入日 | 最終納品日 |
|---|---|---|---|
MSC8252TAG1000B (935317719557) | - | 2017-06-01 | 2017-12-01 |
製品変更のお知らせ
| Part/12NC | 発行日 | 有効期限 | PCN | タイトル |
|---|---|---|---|---|
MSC8252TAG1000B (935317719557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MSC8252TAG1000B (935317719557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
詳細 MSC8252
Archived content is no longer updated and is made available for historical reference only.
The MSC8252 is based on the industry's highest-performance DSP core built on StarCore® technology and designed for the advanced processing requirements and capabilities of today’s high-performance medical imaging, aerospace, defense and advanced test and measurement markets. It delivers higher performance and power savings, leveraging 45 nm process technology in a highly integrated system-on-chip (SoC) to provide performance equivalent to a 2 GHz single-core device. The MSC8252 helps equipment manufacturers create end products and services that integrate more functionality in a smaller hardware footprint.
The MSC8252 DSP delivers a high level of performance and integration, combining two enhanced fully programmable SC3850 cores, each running at up to 1 GHz. The SC3850 DSP core has been independently assessed to enable 40 percent more processing capability per MHz than the nearest DSP competition. A high-performance internal RISC-based QUICC Engine® subsystem supports multiple networking protocols to guarantee reliable data transport over packet networks while significantly offloading processing from the DSP cores.
The MSC8252 embeds a substantial amount of internal memory to support a variety of advanced high-speed interface types, including two serial RapidIO® interfaces, two gigabit Ethernet interfaces for network communications, a PCI Express® controller, two DDR controllers for high-speed, industry standard memory interface and four multichannel TDM interfaces. The MSC8252 allows a high degree of scalability through pin compatibility with all MSC825x and MSC815x DSP devices.