Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
パッケージ
WLCSP48: wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm (Backside coating included)
購入オプション
NXH2261UK/A1BSCZ
アクティブ
12NC: 935331628012
詳細
操作機能
| パラメータ | 値 |
|---|---|
Ambient Operating Temperature (Min to Max) (℃) | -20 to 85 |
Supply Voltage (Min) (V) | 1 |
Supply Voltage (Max) (V) | 1.45 |
Power | 3.4 |
| パラメータ | 値 |
|---|---|
SNR (dBFS) | -93 |
Audio Streams | Up to 4 |
Non-Volatile Memory (kbit) | 512 |
環境
| Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|
NXH2261UK/A1BSCZ(935331628012) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | REACH SVHC | 11.98307112 |
品質
| Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | ||
|---|---|---|---|---|---|
| 鉛はんだ | 鉛フリーはんだ | 鉛はんだ | 鉛フリーはんだ | ||
NXH2261UK/A1BSCZ (935331628012) | No | 1 | 1 | 240 | 260 |
配送
| Part/12NC | 関税分類番号（米国)免責事項: | 輸出規制品目番号（米国） |
|---|---|---|
NXH2261UK/A1BSCZ (935331628012) | 854239 | 3A991A2 |
詳細 NXH22XX
The NXH2261UK is an ultra-low-power wireless single-chip solution optimized for audio and data communication. It uses a magnetic induction radio to provide a robust, tightly contained body area network around each user. It uses near field magnetic induction (NFMI) for wireless audio and data streaming.
It offers a fully integrated Arm® Cortex®-M0-based control subsystem, a magnetic induction (MI) transceiver, an audio data path, and a power management subsystem.
In addition to the Arm Cortex-M0, the control subsystem embeds a 512 kbit EEPROM and a set of standard interfaces.
The audio data path is based on hardware-accelerated audio processing blocks and can be enhanced with a user-programmable CoolFlux DSP®. The integrated power management subsystem supports multiple power domains and runs directly from a ZnAir or NiMH battery.
The device is available in a wafer-level chip-scale (WLCSP) package.