WLAN7301HC 製品情報|NXP

WLAN7301HC

生産終了 (EOL)

WLAN7301HC

生産終了 (EOL)

購入オプション

操作機能

パラメータ
Security Status
COMPANY PUBLIC
Description
Wi-Fi 7, Wi-Fi 6E and Bluetooth Front-End IC, 2.4 GHz

環境

Part/12NC鉛フリーEU RoHSハロゲンフリーRHFインジケーターREACH SVHCWeight (mg)
WLAN7301HCZ(935430381019)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
1.92149

品質

Part/12NC安全保障機能安全吸湿感度レベル (MSL)Peak Package Body Temperature (PPT) (C°)
鉛はんだ鉛フリーはんだ鉛はんだ鉛フリーはんだ
WLAN7301HCZ
(935430381019)
No
1
1
240
260

配送

Part/12NC関税分類番号(米国)免責事項:
WLAN7301HCZ
(935430381019)
854233

詳細 WLAN7301HC

The WLAN7301HC is a 2.4 GHz front-end IC for Wi-Fi 7 and Bluetooth. Available as a 2.1 mm x 1.7 mm x 0.225 mm flip chip die with copper pillar bumps.

The WLAN7301HC includes a transmit power amplifier with five transmit modes for WLAN and two transmit modes for Bluetooth. The WLAN7301HC receive path contains a low noise amplifier with two receive modes and a bypass mode. The Bluetooth amplifier can be separately bypassed.

An integrated directional power coupler allows for output power monitoring in all transmit modes.

The power modes allow optimization of RF performance versus current consumption. Providing excellent power efficiency across typical use cases.

Note: To prevent reliability issues of Cu-pillar products, it is mandatory to select a molded underfill material (MUF) with less than 20 ppm chlorides as per the material supplier specifications.

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