201802016A : MMA8491Q ASECL Transfer and Copper Wire Qualification
NXP Semiconductors announces the assembly transfer of MMA8491Q to ASE-ChungLi Taiwan (ASECL) assembly site. These products were previously assembled at the Carsem Malaysia assembly site.NXP Semiconductors ASE-Chungli Taiwan (ASECL) assembled MMA8491Q products are qualified with the materials change to Gold Palladium Copper (AuPdCu) wire Sumitomo EME-G700LA version P mold compound and Ablestik die attach film ATB-F125E. These products were previously assembled with Gold (Au) wire Sumitomo EME-G770HCD mold compound and Henkel 8006NS (Screen Print) die attach film material.
| PCNタイプ | カテゴリー変更 | 発行日 |
|---|---|---|
| Advanced Product Change Notification | Assembly location, Assembly materials, Assembly process | 02-Mar-2018 |
変更理由
The transfer to ASECL is for consolidation of our assembly sites. The transfer from Gold to Gold Palladium Copper wire is an alignment to industry standard convention for wirebond material type. The change to mold compound and die attach material for QFN 3x3 package is required to standardize the bill of materials for ASECL assembly production.
対象製品の特定について
Product identification does not change There is no change to the orderable part numbers. NXP will have traceability of the assembly site by the 1st and 2nd digit of the tracecode.
予想される影響
データシートの改訂: No impact to existing datasheet
No impact on form fit function reliability or quality.
タイミングとロジスティックス
The Final PCN is planned to be issued on 27-Jul-2018
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
MMA8491QR1 (935310644547) |
- | - | - |
|
MMA8491QR2 (935310644528) |
- | - | - |