201802016F01:MMA8491Q ASECL Transfer and Copper Wire Qualification
  • 製品変更通知 (PCN)
  • 201802016F01

201802016F01 : MMA8491Q ASECL Transfer and Copper Wire Qualification

NXP Semiconductors announces the assembly transfer of the MMA8491Q product from the Carsem Malaysia assembly site to the ASE-ChungLi Taiwan (ASECL) assembly site. This product was qualified with a material change from Gold (Au) bond wire Sumitomo EME-G770HCD mold compound and Henkel 8006NS (Screen Print) die attach film material to Gold Palladium Copper (AuPdCu) bond wire Sumitomo EME-G700LA version P mold compound and Ablestik die attach film ATB-F125E. 

PCNタイプ カテゴリー変更 発行日 有効期限
Final Product Change Notification Assembly location, Assembly materials, Assembly process 20-Jun-2019 18-Sep-2019

変更理由

The assembly transfer to ASECL is for consolidation of NXP assembly sites. The change from Gold to Gold Palladium Copper bond wire is to align with industry standards for bond wire material type. The change of the mold compound and die attach material is to standardize the bill of materials at the ASECL assembly site.

対象製品の特定について

Product identification does not change There is no change to the orderable part numbers. NXP will have traceability of the assembly site by the 1st and 2nd digit of the tracecode.

予想される影響

データシートの改訂: No impact to existing datasheet

No impact on form fit function reliability or quality.

対象品番

品番/12NC 最終購入日 最終納品日 交換品番
MMA8491QR1
(935310644547)
- - -
MMA8491QR2
(935310644528)
- - -