202002035I : HB2000 Data Sheet Update to Rev 8.0 (General and 28-pin HVQFN Clarifications)
NXP Semiconductors announces the data sheet update to revision 8.0 for the HB2000 devices associated with this notification. The revision history included in the updated document provides a detailed description of the changes. Changes are summarized below.Data Sheet Changes:1. Global: changed document status from Advance Information to Product2. Table 1: replaced "PC33HB2000ES" by "MC33HB2000AES"3. Figure 5: updated 28-pin HVQFN pin configuration to indicate four corner pads as AGND4. Section 9.6.3.1: added steps to clear the status register5. Section 10.4.1.6: added note about minimum current for active OL detection6. Section 12.1: added 28-pin HVQFN solder mask information** Documentation change only for customer clarifications - absolutely no changes to the device / product **New HB2000 rev 8.0 data sheet is attached to this notice and can be found at:https://www.nxp.com/docs/en/data-sheet/MC33HB2000.pdfCorresponding ZVEI Delta Qualification Matrix ID: SEM-DS-02
| PCNタイプ | カテゴリー変更 | 発行日 | 有効期限 |
|---|---|---|---|
| Customer Information Notification | Other | 26-Feb-2020 | 27-Feb-2020 |
変更理由
The data sheet has been updated to provide additional technical clarifications regarding fault clearing minimum requirements for active open load detection and 28-pin HVQFN corner pad labels and solder mask diagram.
対象製品の特定について
Product identification does not change
予想される影響
データシートの改訂: A new datasheet will be issued
No impact on form fit function reliability or quality.
対象品番
| 品番／12NC | 最終購入日 | 最終納品日 | 交換品番 |
|---|---|---|---|
|
MC33HB2000AES (935385936557) |
- | - | - |
|
MC33HB2000AESR2 (935385936528) |
- | - | - |
|
MC33HB2000EK (935315555574) |
- | - | - |
|
MC33HB2000EKR2 (935315555518) |
- | - | - |
|
MC33HB2000FK (935312664557) |
- | - | - |
|
MC33HB2000FKR2 (935312664564) |
- | - | - |