NFC-Enabled Digital Wallet

As key player in the mobile wallet ecosystem, NXP provides end-to-end hardware and software solutions for OEMs looking to add secure NFC services to mobile devices and wearables. Benefit from enhanced RF frontend design and robust hardware security to implement new mobile services such as mobile payments and mobile transit.

NXP was the first in the industry to offer a true eSIM convergence solution that combines an eUICC with an embedded secure element (eSE) and certified NFC connectivity in a single footprint. It’s our way of driving the switch to eSIM, and giving developers more ways to be creative with their connectivity.

NFC-Enabled Digital Wallet Products

Product Name Description
SN300 NXP’s third generation eSIM convergence solution, SN300, is designed for simpler development, delivery and operation of secure embedded transactions. This compact, monolithic IC combines independent eSIM, eSE and NFC functions with a secure interface to UWB for faster deployment and enabling new use cases.
SN220 2nd generation single die secured NFC controller product that provides the most advanced generations of NXP Semiconductors NFC controller combined with an Embedded Secure Element.
PN560 Latest standalone NFC controller providing robust implementation for reader and writer modes. Provided in WLCSP or FOWLP for pin-to-pin compatibility to SN220 Secured NFC controller.
SN110 Enhanced 1st generation single-die secured NFC controller product that provides the most advanced generations of NXP Semiconductors NFC controller combined with an Embedded Secure Element.
SN100 1st generation single-die secured NFC controller product that provides the most advanced generations of NXP Semiconductors NFC controller combined with an Embedded Secure Element.
PN81 Stacked-die module combining a PN557 NFC controller and a P73N2M0 embedded Secure Element.
PN557 Standalone NFC controller designed for integration in mobile devices and devices compliant with NFC standards (NFC Forum, NCI, EMVCo, ETSI/SCP).
PN80 Stacked-die module combining a PN553 NFC controller and a P73N2M0 embedded Secure Element.
PN553 Standalone NFC controller designed for integration in mobile devices and devices compliant with NFC standards (NFC Forum, NCI, EMVCo, ETSI/SCP).
P73 Secure Element silicon being used on PN8x NFC stacked-die modules.
NQ440 Stacked-die module combining a PN557 NFC controller and a P73N2M0 embedded Secure Element. NQ440 provides same as PN81 product family and is pre-integrated with Qualcomm platform reference design.
NQ410 Standalone NFC controller designed for integration in mobile devices and devices compliant with NFC standards (NFC Forum, NCI, EMVCo, ETSI/SCP). NQ410 provides same as PN557 product family and is pre-integrated with Qualcomm platform reference design.
NQ330 Stacked-die module combining a PN553 NFC controller and a P73N2M0 embedded Secure Element. . NQ330 provides same as PN80 product family and is pre-integrated with Qualcomm platform reference design.
NQ310 Standalone NFC controller designed for integration in mobile devices and devices compliant with NFC standards (NFC Forum, NCI, EMVCo, ETSI/SCP). NQ310 provides same as PN553 product family and is pre-integrated with Qualcomm platform reference design.
NPC300 2nd generation NFC controller design for Personal Computer integration that provides reader and writer modes compliant with NFC standards (NFC Forum, NCI, EMVCo, ETSI/SCP).

Product Features

  • High-level security
    • CC EAL 6+/EMVCo certified hardware
    • CC EAL 5+ platform certified (with JCOP)
    • CFNR Chinese security certification
  • Broad standards compliance
    • GSMA Consumer Devices - SGP22 specification
    • SIM Alliance interoperable profile compliant
    • JCOP: Global Platform, Java Card 3
  • Contactless interoperability
    • MIFARE, FeliCa GP/Japan, Calypso, CEPAS, China Transit, mPOS (Visa, MasterCard, …)
  • Large set of interfaces
    • UART-ISO7816, HS-UART, SWP, SPI, I²C
  • Secure concurrent operation of eSIM/NFC/eSE
  • Tiny WLCSP packages

First HONOR Flagship Smartphone Provides Benefits of Convergence eSIM

NXP’s SN110 family enables HONOR smartphones that are shipping to Europe and other overseas markets to perform a multitude of mobile services at once.

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Product Benefits

  • Lower BoM cost thanks to single-chip solution
  • Enhanced RF performance
  • Concurrent secure transactions
  • Low power consumption during mobile service performance
  • Upgradability
  • Interoperability stressed with service providers and MNOs in the ecosystem
  • High endurance
  • Interoperability and standards compliance
  • Over-the-air reprogrammable eSIM for global connectivity devices
  • Small form factor to support miniaturization
  • Optional out-of-the-box activation with pre-loaded operator profile(s)

How the eSIM Heralded Development of the First Convergence IC

New technologies, use cases, applications and user experiences are front-and-center focus points for NXP. We are on a a constant search for new ways to apply our expertise and innovate solutions to challenging problems.

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