LA1223X7S84AB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LA1223X7S84ABLast Revision (GMT):
Wednesday, 29 May 2024, 08:02:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LA1223X7S84ABSOT2037FBGA6213107.176220 mg YesNoYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 442 815572023-11-2410Not ApplicableNot ApplicableNot Applicable3 / 168 hours25030 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-74.71720040.0000000.151816
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.76895015.0000000.056931
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-25.30685045.0000000.170793
Subtotal11.793000100.00000000.379541
LidLidCopper and its compoundsCopper, metal7440-50-81896.27400198.45000061.028853
Nickel and its compoundsNickel, metal7440-02-029.8550001.5500000.960840
Subtotal1926.129000100.000000061.989693
ResistorCeramicAluminum and its compoundsAluminum oxide1302-74-51.65711596.0000000.053332
Inorganic Silicon compoundsQuartz14808-60-70.0516122.9900000.001661
Magnesium and its compoundsMagnesium-oxide1309-48-40.0174341.0100000.000561
Subtotal1.726161100.00000000.055554
ConductorChromium and Chromium III compoundsChromium, metal7440-47-30.00143819.4500000.000046
Nickel and its compoundsNickel, metal7440-02-00.00595780.5500000.000192
Subtotal0.007395100.00000000.000238
Inner ElectrodeInorganic Silicon compoundsFibrous-glass-wool65997-17-30.04057877.7700000.001306
Palladium and its compoundsPalladium, metal7440-05-30.00559310.7200000.000180
Silver and its compoundsSilver, metal7440-22-40.00600611.5100000.000193
Subtotal0.052177100.00000000.001679
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0001150.1000000.000004
Nickel and its compoundsNickel, metal7440-02-00.11492199.9000000.003699
Subtotal0.115036100.00000000.003702
Protective CoatingInorganic Silicon compoundsSilica, vitreous60676-86-00.01198835.3700000.000386
Magnesium and its compoundsTalc14807-96-60.00392511.5800000.000126
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.01798153.0500000.000579
Subtotal0.033895100.00000000.001091
Resistive LayerLead and its compoundsFrits, chemicals65997-18-40.00852550.0000000.000274
Ruthenium and its compoundsRuthenium oxide12036-10-10.00852550.0000000.000274
Subtotal0.017050100.00000000.000549
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0001020.1000000.000003
Tin and its compoundsTin, metal7440-31-50.10240399.9000000.003296
Subtotal0.102506100.00000000.003299
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-3132.79588098.0000004.273845
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.7101202.0000000.087221
Subtotal135.506000100.00000004.361066
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-45.3058953.5000000.170763
Tin and its compoundsTin, metal7440-31-5146.29110596.5000004.708169
Subtotal151.597000100.00000004.878932
Solder PasteSolder PasteCopper and its compoundsCopper, metal7440-50-80.0006100.5000000.000020
Silver and its compoundsSilver, metal7440-22-40.0036603.0000000.000118
Tin and its compoundsTin, metal7440-31-50.11773096.5000000.003789
Subtotal0.122000100.00000000.003926
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8311.46240299.99000010.023970
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0311490.0100000.001002
Subtotal311.493551100.000000010.024972
Solder 1Copper and its compoundsCopper, metal7440-50-80.0375740.7000000.001209
Tin and its compoundsTin, metal7440-31-55.33011399.3000000.171542
Subtotal5.367686100.00000000.172751
Solder 2Copper and its compoundsCopper, metal7440-50-80.1799010.5000000.005790
Silver and its compoundsSilver, metal7440-22-41.0794083.0000000.034739
Tin and its compoundsTin, metal7440-31-534.72096396.5000001.117444
Subtotal35.980273100.00000001.157973
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.43360823.5000000.013955
Inorganic Silicon compoundsSilica, vitreous60676-86-00.28599715.5000000.009204
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0922575.0000000.002969
PolymersPlastic: EP - Epoxide, Epoxy1.03328056.0000000.033255
Subtotal1.845142100.00000000.059383
Substrate Build UpEpoxy ResinsBisphenol A diglycidyl ether1675-54-312.07737810.4500000.388693
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-512.07737810.4500000.388693
Inorganic Silicon compoundsSilicon dioxide7631-86-948.36730041.8500001.556632
PolymersPlastic: EP - Epoxide, Epoxy43.05094237.2500001.385533
Subtotal115.572998100.00000003.719551
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3184.22067550.0000005.928878
Inorganic Silicon compoundsSilica, vitreous60676-86-073.68827020.0000002.371551
PolymersPlastic: EP - Epoxide, Epoxy110.53240530.0000003.557327
Subtotal368.441349100.000000011.857755
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-514.15088072.0000000.455426
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3930802.0000000.012651
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones1.5723208.0000000.050603
Zinc and its compoundsZinc oxide1314-13-23.53772018.0000000.113856
Subtotal19.654000100.00000000.632536
UnderfillUnderfillAromatic amines and their salts6-methyl-2,4-bis(methylthio)phenylene-1,3-diamine106264-79-30.4539772.0998000.014611
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-60.7566353.4997000.024351
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-54.10738918.9981000.132190
Inorganic Silicon compoundsSilica, vitreous60676-86-014.48393066.9932000.466145
Inorganic compoundsCarbon Black1333-86-40.0172960.0800000.000557
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3977651.8398000.012802
Organic compoundsOther organic compounds.1.3619306.2994000.043832
Phosphorus compoundsTriphenyl phosphine603-35-00.0410780.1900000.001322
Subtotal21.620000100.00000000.695809
Total3107.176220100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LA1223X7S84AB
Product content declaration of LA1223X7S84AB
上次修订 Last Revision (GMT):
Wednesday, 29 May 2024, 08:02:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
盖子
Lid
盖子
Lid
OOOOOO
电阻
Resistor
陶瓷的
Ceramic
OOOOOO

导体
Conductor
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

防护涂料
Protective Coating
OOOOOO

电阻层
Resistive Layer
XOOOOO

镀锡
Tin Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LA1223X7S84ABLast Revision (GMT):
Wednesday, 29 May 2024, 08:02:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
LidC1100Test Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
NI PLATINGTest Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
ResistorCERAMICTest Report
15 Jan 2024
Test Report
15 Jan 2024
Test Report
15 Jan 2024
Test Report
15 Jan 2024
CONDUCTORTest Report
27 Sep 2023
Test Report
27 Sep 2023
Test Report
27 Sep 2023
Test Report
27 Sep 2023
NI PLATINGTest Report
28 Jun 2024
Test Report
28 Jun 2024
Test Report
28 Jun 2024
Test Report
28 Jun 2024
OVERCOATTest Report
27 Sep 2023
Test Report
27 Sep 2023
Test Report
27 Sep 2023
Test Report
27 Sep 2023
RESISTIVE LAYERTest Report
27 Sep 2023
Test Report
27 Sep 2023
Test Report
27 Sep 2023
Test Report
27 Sep 2023
SN PLATINGTest Report
20 Dec 2023
Test Report
20 Dec 2023
Test Report
20 Dec 2023
Test Report
20 Dec 2023
TERMINATIONTest Report
3 Oct 2023
Test Report
3 Oct 2023
Test Report
3 Oct 2023
Test Report
3 Oct 2023
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Solder PasteTest Report
23 Jan 2024
Test Report
23 Jan 2024
Test Report
23 Jan 2024
Test Report
23 Jan 2024
SubstrateABF-GX13Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E700GRTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
SOP 1Test Report
11 Mar 2024
Test Report
11 Mar 2024
Test Report
11 Mar 2024
Test Report
11 Mar 2024
SOP 2Test Report
31 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
31 Jan 2024
SR7300GR-BNot AvailableNot AvailableNot AvailableNot Available
Thermally Conductive GelTest Report
31 Jul 2024
Test Report
31 Jul 2024
Test Report
31 Jul 2024
Test Report
31 Jul 2024
UnderfillTest Report
19 Mar 2024
Test Report
19 Mar 2024
Test Report
19 Mar 2024
Test Report
19 Mar 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.