MC8641DTVJ1333JE

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of MC8641DTVJ1333JELast Revision (GMT):
Sunday, 04 August 2024, 10:58:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC8641DTVJ1333JESOT1601-1CBGA10235456.534700 mg YesYesYesTin/Silver (Sn/Ag)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 183 965572023-11-2483 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-795.61480065.4000001.752299
Copper and its compoundsCopper, metal7440-50-820.17560013.8000000.369751
Nickel and its compoundsNickel, metal7440-02-028.50900019.5000000.522474
Tin and its compoundsTin, metal7440-31-51.9006001.3000000.034832
Subtotal146.200000100.00000002.679356
Ceramic SubstrateCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1105.8812463.1300001.940449
Barium and its compoundsBarium oxide1304-28-5635.62575218.79000011.648891
Boron and its compoundsBoron oxide1303-86-2139.7091204.1300002.560400
Calcium and its compoundsCalcium monoxide1305-78-877.4658312.2900001.419689
Chromium and Chromium III compoundsDichromium trioxide1308-38-913.5311500.4000000.247981
Copper and its compoundsCuprous oxide1317-39-13.3827870.1000000.061995
Inorganic Silicon compoundsSilicon dioxide7631-86-92331.07879768.91000042.720864
Strontium and its compoundsStrontium Oxide1314-11-08.4569690.2500000.154988
Zirconium and its compoundsZirconium oxide1314-23-467.6557482.0000001.239903
Subtotal3382.787400100.000000061.995160
Gold PlatingGold and its compoundsGold, metal7440-57-52.35164599.9900000.043098
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0002350.0100000.000004
Subtotal2.351880100.00000000.043102
Nickel PlatingLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0105830.0600000.000194
Nickel and its compoundsNickel, metal7440-02-015.85049589.8600000.290486
Palladium and its compoundsPalladium, metal7440-05-30.1905021.0800000.003491
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-01.5875199.0000000.029094
Subtotal17.639100100.00000000.323266
Under Bump MetalClayCeramic materials and wares66402-68-421.6115044.1800000.396066
Copper and its compoundsCopper, metal7440-50-8495.41011695.8200009.079208
Subtotal517.021620100.00000009.475274
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped287.40696389.6000005.267207
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.8869000.9000000.052907
Nickel and its compoundsNickel, metal7440-02-01.6038330.5000000.029393
Silver and its compoundsSilver, metal7440-22-41.0104150.3150000.018517
Tin and its compoundsTin, metal7440-31-527.8585888.6850000.510555
Subtotal320.766700100.00000005.878579
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-430.0369303.5000000.550476
Tin and its compoundsTin, metal7440-31-5828.16107096.50000015.177418
Subtotal858.198000100.000000015.727894
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-851.53100096.5000000.944391
Silver and its compoundsSilver, metal7440-22-41.6020003.0000000.029359
Tin and its compoundsTin, metal7440-31-50.2670000.5000000.004893
Subtotal53.400000100.00000000.978643
Solder PasteSolder PasteCopper and its compoundsCopper, metal7440-50-80.5987800.7000000.010974
Silver and its compoundsSilver, metal7440-22-43.2505203.8000000.059571
Tin and its compoundsTin, metal7440-31-581.69070095.5000001.497117
Subtotal85.540000100.00000001.567662
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-37.98930011.0000000.146417
Bismuth and its compoundsBismuth nitrate10361-44-10.0726300.1000000.001331
Bismuth and its compoundsBismuth trioxide1304-76-30.5810400.8000000.010648
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-610.16820014.0000000.186349
Epoxy ResinsOther Epoxy resins2.9052004.0000000.053243
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-57.26300010.0000000.133106
Inorganic Silicon compoundsSilica, vitreous60676-86-043.57800060.0000000.798639
Inorganic compoundsCarbon Black1333-86-40.0726300.1000000.001331
Subtotal72.630000100.00000001.331065
Total5456.534700100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC8641DTVJ1333JE
Product content declaration of MC8641DTVJ1333JE
上次修订 Last Revision (GMT):
Sunday, 04 August 2024, 10:58:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
陶瓷基板
Ceramic Substrate
陶瓷的
Ceramic
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

焊料凸点下的金属
Under Bump Metal
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC8641DTVJ1333JELast Revision (GMT):
Sunday, 04 August 2024, 10:58:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Ceramic SubstrateAU PLATINGNot AvailableNot AvailableNot AvailableNot Available
CERAMICNot AvailableNot AvailableNot AvailableNot Available
METALLIZATIONNot AvailableNot AvailableNot AvailableNot Available
NI PLATINGNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Solder PasteNot AvailableNot AvailableNot AvailableNot Available
UnderfillTest Report
11 Sep 2024
Test Report
11 Sep 2024
Test Report
11 Sep 2024
Test Report
11 Sep 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.