MIMX9302CVVXDAB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MIMX9302CVVXDABLast Revision (GMT):
Saturday, 31 August 2024, 10:05:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MIMX9302CVVXDABSOT2167LFBGA3061166.675000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 547 195572024-01-1083 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantInorganic Silicon compoundsSilica, vitreous60676-86-086.44392072.0000007.409426
Inorganic Silicon compoundsSilicon dioxide7631-86-910.2051858.5000000.874724
Inorganic compoundsCarbon Black1333-86-40.6003050.5000000.051454
Inorganic compoundsProprietary Material - Other inorganic compounds4.2021353.5000000.360180
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-44.2021353.5000000.360180
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins4.2021353.5000000.360180
PolymersPlastic: EP - Epoxide, Epoxy10.2051858.5000000.874724
Subtotal120.061000100.000000010.290869
Semiconductor DieDieInorganic Silicon compoundsSilicon, doped792.59174489.60000067.935950
Miscellaneous substancesProprietary Material-Other miscellaneous substances.7.9613010.9000000.682392
Nickel and its compoundsNickel, metal7440-02-04.4229450.5000000.379107
Silver and its compoundsSilver, metal7440-22-42.7864550.3150000.238837
Tin and its compoundsTin, metal7440-31-576.8265558.6850006.585086
Subtotal884.589000100.000000075.821373
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-41.1223803.5000000.096203
Tin and its compoundsTin, metal7440-31-530.94562096.5000002.652463
Subtotal32.068000100.00000002.748666
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-840.80241799.9900003.497325
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0040810.0100000.000350
Subtotal40.806498100.00000003.497675
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0109160.1000000.000936
Barium and its compoundsBarium sulfate7727-43-72.12869619.5000000.182458
Inorganic Silicon compoundsSilicon dioxide7631-86-91.0807229.9000000.092633
Magnesium and its compoundsTalc14807-96-60.3165752.9000000.027135
Organic compoundsOther organic compounds.0.5894855.4000000.050527
Phosphorus compoundsDiphenyl(2,4,6-trimethylbenzoyl)phosphine oxide75980-60-80.0873310.8000000.007485
PolymersPlastic: EP - Epoxide, Epoxy1.35363212.4000000.116025
PolymersPlastic: PAK5.34903049.0000000.458485
Subtotal10.916388100.00000000.935684
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-343.30258255.3500003.711623
Inorganic Silicon compoundsSilicon dioxide7631-86-916.21010820.7200001.389428
Miscellaneous substancesProprietary Material-Other miscellaneous substances.4.5141085.7700000.386921
PolymersPlastic: EP - Epoxide, Epoxy14.20731518.1600001.217761
Subtotal78.234114100.00000006.705733
Total1166.675000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MIMX9302CVVXDAB
Product content declaration of MIMX9302CVVXDAB
上次修订 Last Revision (GMT):
Saturday, 31 August 2024, 10:05:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MIMX9302CVVXDABLast Revision (GMT):
Saturday, 31 August 2024, 10:05:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
Semiconductor DieCU PLATINGTest Report
20 Dec 2023
Test Report
20 Dec 2023
Test Report
20 Dec 2023
Not Available
DIETest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
HD4100Test Report
17 Nov 2023
Test Report
17 Nov 2023
Test Report
17 Nov 2023
Test Report
17 Nov 2023
SNAG PLATINGTest Report
20 Dec 2023
Test Report
20 Dec 2023
Test Report
20 Dec 2023
Not Available
UBM CUTest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
UBM TITest Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Not Available
Solder Ball - Lead FreeTest Report
16 Jan 2024
Test Report
16 Jan 2024
Test Report
16 Jan 2024
Test Report
16 Jan 2024
SubstrateAUS SR-1Test Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
23 Mar 2023
Test Report
23 Mar 2023
COPPER FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
HL832NSTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
8 Feb 2023
Test Report
29 Dec 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.