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MPC8270CZUQLDA

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8270CZUQLDALast Revision (GMT):
Tuesday, 03 September 2024, 04:45:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8270CZUQLDASOT1752-1LBGA48010421.584116 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 191 735572023-11-2411Not ApplicableNot ApplicableNot Applicable4 / 72 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-523.60575599.9900000.226508
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0023610.0100000.000023
Subtotal23.608116100.00000000.226531
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins18.5850005.0000000.178332
Inorganic Silicon compoundsSilica, vitreous60676-86-0249.03900067.0000002.389646
Inorganic Silicon compoundsSilicon dioxide7631-86-992.92500025.0000000.891659
Inorganic compoundsCarbon Black1333-86-41.8585000.5000000.017833
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins9.2925002.5000000.089166
Subtotal371.700000100.00000003.566636
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.88000012.0000000.027635
Epoxy ResinsProprietary Material-Other Epoxy resins1.6800007.0000000.016120
Silver and its compoundsSilver, metal7440-22-419.44000081.0000000.186536
Subtotal24.000000100.00000000.230291
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped74.48000098.0000000.714671
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.5200002.0000000.014585
Subtotal76.000000100.00000000.729256
Solder Ball - Low LeadSolder Ball - Low LeadAluminum and its compoundsAluminum, metal7429-90-50.0098080.0010000.000094
Antimony and its compoundsAntimony, metal7440-36-00.0098080.0010000.000094
Arsenic and its compoundsArsenic, metal7440-38-20.0196160.0020000.000188
Bismuth and its compoundsBismuth, metal7440-69-90.0107880.0011000.000103
Copper and its compoundsCopper, metal7440-50-80.0098080.0010000.000094
Iron and its compoundsIron, metal7439-89-60.0166730.0017000.000160
Lead and its compoundsLead, metallic lead and lead alloys7439-92-1353.09407236.0015003.388104
Nickel and its compoundsNickel, metal7440-02-00.0362890.0037000.000348
Silver and its compoundsSilver, metal7440-22-419.5350961.9918000.187448
Tin and its compoundsTin, metal7440-31-5608.02423561.9942005.834278
Zinc and its compoundsZinc, metal7440-66-60.0098080.0010000.000094
Subtotal980.776000100.00000009.411007
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum, metal7429-90-50.4472750.0050000.004292
Aromatic hydrocarbon compoundsOther Aromatic hydrocarbon compounds0.1341830.0015000.001288
Barium and its compoundsOther barium compounds0.0984010.0011000.000944
Copper and its compoundsCopper, metal7440-50-88903.91237199.53510085.437226
Copper and its compoundsCupric oxide1317-38-012.3447900.1380000.118454
Gold and its compoundsGold, metal7440-57-51.3686610.0153000.013133
Inorganic compoundsOther inorganic compounds0.2773110.0031000.002661
Manganese and its compoundsManganese, metal7439-96-50.4472750.0050000.004292
Nickel and its compoundsNickel, metal7440-02-00.8677140.0097000.008326
Organic Silicon compoundsOther organic Silicon Compounds0.0894550.0010000.000858
Organic compoundsOther organic compounds.2.6657590.0298000.025579
PolymersOther non-halogenated polymers0.2952020.0033000.002833
PolymersPlastic: PI - Polyimide8.4713880.0947000.081287
PolymersProprietary Material-Other acrylic/epoxy resin mixture5.1883900.0580000.049785
Zirconium and its compoundsZirconium, metal7440-67-78.8918270.0994000.085321
Subtotal8945.500000100.000000085.836279
Total10421.584116100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8270CZUQLDA
Product content declaration of MPC8270CZUQLDA
上次修订 Last Revision (GMT):
Tuesday, 03 September 2024, 04:45:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8270CZUQLDALast Revision (GMT):
Tuesday, 03 September 2024, 04:45:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.