MPC8347ECVRADDB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8347ECVRADDBLast Revision (GMT):
Wednesday, 06 November 2024, 12:08:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8347ECVRADDBSOT1627-1HBGA6204269.141408 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 240 875572023-11-2453 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-87.68376697.0000000.179984
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2376423.0000000.005567
Subtotal7.921408100.00000000.185550
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins57.3350005.0000001.343010
Inorganic Silicon compoundsSilica, vitreous60676-86-0768.28900067.00000017.996335
Inorganic Silicon compoundsSilicon dioxide7631-86-9286.67500025.0000006.715051
Inorganic compoundsCarbon Black1333-86-45.7335000.5000000.134301
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins28.6675002.5000000.671505
Subtotal1146.700000100.000000026.860202
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.11600012.0000000.026141
Epoxy ResinsProprietary Material-Other Epoxy resins0.6510007.0000000.015249
Silver and its compoundsSilver, metal7440-22-47.53300081.0000000.176452
Subtotal9.300000100.00000000.217842
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsProprietary Material-Other silica compounds1.25563221.2819000.029412
Inorganic Silicon compoundsQuartz14808-60-70.0472710.8012000.001107
Inorganic Silicon compoundsSilica, vitreous60676-86-01.25563221.2819000.029412
Inorganic compoundsCarbon Black1333-86-40.0472710.8012000.001107
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.59088510.0150000.013841
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.3397575.7586000.007958
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.36355240.0602000.055364
Subtotal5.900000100.00000000.138201
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-81083.93066096.97000025.389898
Copper and its compoundsCupric oxide1317-38-01.1178000.1000000.026183
Inorganic compoundsCarbon Black1333-86-43.9123000.3500000.091641
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3353400.0300000.007855
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-328.5039002.5500000.667673
Subtotal1117.800000100.000000026.183251
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped29.40000098.0000000.688663
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6000002.0000000.014054
Subtotal30.000000100.00000000.702717
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-418.2042003.5000000.426414
Tin and its compoundsTin, metal7440-31-5501.91580096.50000011.756832
Subtotal520.120000100.000000012.183246
SubstrateCopper CoreCopper and its compoundsCopper, metal7440-50-8277.52070599.9900006.500621
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0277550.0100000.000650
Subtotal277.548460100.00000006.501271
Copper PlatingCopper and its compoundsCopper, metal7440-50-8441.78480599.98000010.348329
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0883750.0200000.002070
Subtotal441.873180100.000000010.350399
Gold PlatingGold and its compoundsGold, metal7440-57-51.57438399.9900000.036878
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001580.0100000.000004
Subtotal1.574540100.00000000.036882
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0028770.0300000.000067
Nickel and its compoundsNickel, metal7440-02-09.58750399.9700000.224577
Subtotal9.590380100.00000000.224644
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0684210.1000000.001603
Barium and its compoundsBarium sulfate7727-43-719.91048829.1000000.466382
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4105250.6000000.009616
Magnesium and its compoundsTalc14807-96-62.0526283.0000000.048081
Organic compoundsOther organic compounds.2.4631533.6000000.057697
PolymersPlastic: EP - Epoxide, Epoxy13.34207919.5000000.312524
PolymersPlastic: PAK30.17362644.1000000.706784
Subtotal68.420920100.00000001.602686
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-389.08939147.6200002.086822
Inorganic Silicon compoundsSilica, vitreous60676-86-08.9051974.7600000.208595
PolymersPlastic: PI - Polyimide89.08939147.6200002.086822
Subtotal187.083980100.00000004.382239
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-3142.49873332.0000003.337878
Inorganic Silicon compoundsSilica, vitreous60676-86-026.7185126.0000000.625852
PolymersPlastic: PI - Polyimide276.09129562.0000006.467139
Subtotal445.308540100.000000010.430869
Total4269.141408100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8347ECVRADDB
Product content declaration of MPC8347ECVRADDB
上次修订 Last Revision (GMT):
Wednesday, 06 November 2024, 12:08:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8347ECVRADDBLast Revision (GMT):
Wednesday, 06 November 2024, 12:08:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
11 Sep 2024
Test Report
11 Sep 2024
Test Report
11 Sep 2024
Test Report
11 Sep 2024
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy Adhesive 1Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Epoxy Adhesive 2Test Report
10 Sep 2024
Test Report
10 Sep 2024
Test Report
10 Sep 2024
Test Report
10 Sep 2024
Heat SpreaderTest Report
25 Jun 2024
Test Report
25 Jun 2024
Test Report
25 Jun 2024
Test Report
25 Jun 2024
Semiconductor DieTest Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Solder Ball - Lead FreeTest Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
SubstrateAUS 703Test Report
10 Nov 2022
Test Report
10 Nov 2022
Test Report
10 Nov 2022
Test Report
10 Nov 2022
COPPER FOILTest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
E679FG SERIESTest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
21 Dec 2021
SOLDER MASKNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.