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MPC855TCZQ66D4

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC855TCZQ66D4Last Revision (GMT):
Monday, 05 August 2024, 12:11:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC855TCZQ66D4SOT1666BGA3572232.689986 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 191 795572023-11-249Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-88.01317297.8650000.358902
Gold and its compoundsGold, metal7440-57-50.0110540.1350000.000495
Palladium and its compoundsPalladium, metal7440-05-30.1637602.0000000.007335
Subtotal8.187986100.00000000.366732
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins46.9500006.0000002.102845
Inorganic Silicon compoundsSilica, vitreous60676-86-0579.05000074.00000025.935083
Inorganic Silicon compoundsSilicon dioxide7631-86-9117.37500015.0000005.257111
Inorganic compoundsCarbon Black1333-86-43.9125000.5000000.175237
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-415.6500002.0000000.700948
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins19.5625002.5000000.876185
Subtotal782.500000100.000000035.047409
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.79200012.0000000.035473
Epoxy ResinsProprietary Material-Other Epoxy resins0.4620007.0000000.020692
Silver and its compoundsSilver, metal7440-22-45.34600081.0000000.239442
Subtotal6.600000100.00000000.295608
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped41.60100098.0000001.863268
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8490002.0000000.038026
Subtotal42.450000100.00000001.901294
Solder Ball - Low LeadSolder Ball - Low LeadAluminum and its compoundsAluminum, metal7429-90-50.0072940.0010000.000327
Antimony and its compoundsAntimony, metal7440-36-00.0072940.0010000.000327
Arsenic and its compoundsArsenic, metal7440-38-20.0145890.0020000.000653
Bismuth and its compoundsBismuth, metal7440-69-90.0080240.0011000.000359
Copper and its compoundsCopper, metal7440-50-80.0072940.0010000.000327
Iron and its compoundsIron, metal7439-89-60.0124010.0017000.000555
Lead and its compoundsLead, metallic lead and lead alloys7439-92-1262.61366236.00150011.762209
Nickel and its compoundsNickel, metal7440-02-00.0269900.0037000.001209
Silver and its compoundsSilver, metal7440-22-414.5292251.9918000.650750
Tin and its compoundsTin, metal7440-31-5452.21793261.99420020.254399
Zinc and its compoundsZinc, metal7440-66-60.0072940.0010000.000327
Subtotal729.452000100.000000032.671441
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-8136.86544099.9900006.130069
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0136880.0100000.000613
Subtotal136.879128100.00000006.130682
Copper PlatingCopper and its compoundsCopper, metal7440-50-8108.33302899.9800004.852130
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0216710.0200000.000971
Subtotal108.354699100.00000004.853101
Gold PlatingGold and its compoundsGold, metal7440-57-51.99039499.9900000.089148
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001990.0100000.000009
Subtotal1.990593100.00000000.089157
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0038020.0300000.000170
Nickel and its compoundsNickel, metal7440-02-012.66965299.9700000.567461
Subtotal12.673454100.00000000.567632
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.1127340.1000000.005049
Barium and its compoundsBarium sulfate7727-43-732.80559529.1000001.469331
Inorganic Silicon compoundsSilicon dioxide7631-86-90.6764040.6000000.030295
Magnesium and its compoundsTalc14807-96-63.3820203.0000000.151477
Organic compoundsOther organic compounds.4.0584243.6000000.181773
PolymersPlastic: EP - Epoxide, Epoxy21.98313119.5000000.984603
PolymersPlastic: PAK49.71569644.1000002.226717
Subtotal112.734004100.00000005.049246
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3145.43406150.0000006.513849
Inorganic Silicon compoundsSilica, vitreous60676-86-014.5434065.0000000.651385
PolymersPlastic: EP - Epoxide, Epoxy130.89065545.0000005.862464
Subtotal290.868122100.000000013.027699
Total2232.689986100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC855TCZQ66D4
Product content declaration of MPC855TCZQ66D4
上次修订 Last Revision (GMT):
Monday, 05 August 2024, 12:11:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC855TCZQ66D4Last Revision (GMT):
Monday, 05 August 2024, 12:11:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
9 Apr 2024
Test Report
9 Apr 2024
Test Report
9 Apr 2024
Test Report
9 Apr 2024
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuAU PLATINGTest Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
AUS308Not AvailableNot AvailableNot AvailableNot Available
CORETest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
29 Mar 2024
Test Report
29 Mar 2024
Test Report
29 Mar 2024
Test Report
29 Mar 2024
NI PLATINGTest Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.