MPX2300DT1

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPX2300DT1Last Revision (GMT):
Wednesday, 28 August 2024, 03:44:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPX2300DT1SOT1843-1SIL4171.299914 mg NoYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 137 391282023-11-248NA / Not AvailableNot ApplicableNot ApplicableNot ApplicableNot ApplicableNot ApplicableNot ApplicableExternal manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.19989499.9900000.116692
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000200.0100000.000012
Subtotal0.199914100.00000000.116704
Copper Lead-Frame, Pre-PlatedCopper AlloyCopper and its compoundsCopper (I) phosphide12019-57-70.1905450.1900000.111235
Copper and its compoundsCopper, metal7440-50-895.08226594.81050055.506312
Tin and its compoundsTin, metal7440-31-55.0138314.9995002.926931
Subtotal100.286640100.000000058.544478
Gold PlatingGold and its compoundsGold, metal7440-57-50.06257799.9000000.036531
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000630.1000000.000037
Subtotal0.062640100.00000000.036568
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0009080.1000000.000530
Nickel and its compoundsNickel, metal7440-02-00.90737299.9000000.529698
Subtotal0.908280100.00000000.530228
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000940.1000000.000055
Palladium and its compoundsPalladium, metal7440-05-30.09386699.9000000.054796
Subtotal0.093960100.00000000.054851
Polyimide CoatingGold and its compoundsGold, metal7440-57-50.0607730.1100000.035478
PolymersPolysulfone - Phenol, 4,4'-(1-methylethylidene)bis-, polymer with 1,1'-sulfonylbis(4-chlorobenzene)25154-01-254.13798697.99000031.604211
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.9226501.6700000.538617
Zinc and its compoundsZinc oxide1314-13-20.1270720.2300000.074181
Subtotal55.248480100.000000032.252485
Die Encapsulant 1Die EncapsulantOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0450001.0000000.026270
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-24.45500099.0000002.600702
Subtotal4.500000100.00000002.626971
Die Encapsulant 2Die EncapsulantCalcium and its compoundsCalcium/Limestone1317-65-30.3375007.5000000.197023
Chromium and Chromium III compoundsC.I. Pigment Black 2868186-91-41.12500025.0000000.656743
Organic Silicon compoundsPolydimethyl silicones and siloxanes63148-62-93.03750067.5000001.773206
Subtotal4.500000100.00000002.626972
Epoxy AdhesiveEpoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0570003.0000000.033275
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-90.47500025.0000000.277291
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-10.47500025.0000000.277291
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.89300047.0000000.521308
Subtotal1.900000100.00000001.109166
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-33.52800098.0000002.059546
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0720002.0000000.042031
Subtotal3.600000100.00000002.101577
Total171.299914100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPX2300DT1
Product content declaration of MPX2300DT1
上次修订 Last Revision (GMT):
Wednesday, 28 August 2024, 03:44:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜合金
Copper Alloy
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO

聚酰亚胺涂料
Polyimide Coating
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPX2300DT1Last Revision (GMT):
Wednesday, 28 August 2024, 03:44:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
20 Nov 2020
Test Report
21 Dec 2018
Test Report
21 Dec 2018
Test Report
21 Dec 2018
CDA 194Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
NI PLATINGTest Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
PD PLATINGTest Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Die Encapsulant 1Test Report
10 Jan 2018
Test Report
10 Jan 2018
Test Report
10 Jan 2018
Not Available
Die Encapsulant 2Test Report
14 Jun 2018
Test Report
14 Jun 2018
Test Report
14 Jun 2018
Test Report
14 Jun 2018
Epoxy AdhesiveTest Report
26 Mar 2024
Test Report
26 Mar 2024
Test Report
26 Mar 2024
Test Report
26 Mar 2024
Semiconductor DieTest Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.