NTM88H135T1
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| NXP Semiconductors | ||
| Product content declaration of NTM88H135T1 | Last Revision (GMT): Sunday, 04 August 2024, 09:22:00 PM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| NTM88H135T1 | SOT1931 | HQFN24 | 113.050000 mg | Yes | Yes | Yes | Nickel/Palladium/Gold (Ni/Pd/Au) | Cu alloy | e4 | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9354 002 31528 | 2023-11-24 | 10 | 3 / 168 hours | 260 | 40 sec. | Not Applicable | Not Applicable | Not Applicable | 3 | Bangkok, Thailand;External manufacturing |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Bonding Wire - Au | Bonding Wire - Au | Gold and its compounds | Gold, metal | 7440-57-5 | 0.039996 | 99.990000 | 0.035379 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000004 | 0.010000 | 0.000003 | |||
| Subtotal | 0.040000 | 100.0000000 | 0.035382 | ||||
| Bonding Wire - CuPdAu | Bonding Wire - CuPdAu | Copper and its compounds | Copper, metal | 7440-50-8 | 0.086895 | 96.550000 | 0.076864 |
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.000315 | 0.350000 | 0.000279 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.002790 | 3.100000 | 0.002468 | ||
| Subtotal | 0.090000 | 100.0000000 | 0.079611 | ||||
| Copper Lead-Frame, Pre-Plated NiPdAu | Copper Lead-Frame, Pre-Plated NiPdAu | Copper and its compounds | Copper, metal | 7440-50-8 | 23.719878 | 96.540000 | 20.981759 |
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.002457 | 0.010000 | 0.002173 | ||
| Iron and its compounds | Iron, metal | 7439-89-6 | 0.560196 | 2.280000 | 0.495529 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.233415 | 0.950000 | 0.206471 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.009828 | 0.040000 | 0.008693 | ||
| Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.007371 | 0.030000 | 0.006520 | ||
| Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.036855 | 0.150000 | 0.032601 | ||
| Subtotal | 24.570000 | 100.0000000 | 21.733746 | ||||
| Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 3.375400 | 7.000000 | 2.985759 | |
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 38.431340 | 79.700000 | 33.994993 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 4.822000 | 10.000000 | 4.265369 | ||
| Inorganic compounds | Carbon Black | 1333-86-4 | 0.144660 | 0.300000 | 0.127961 | ||
| Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 1.446600 | 3.000000 | 1.279611 | |||
| Subtotal | 48.220000 | 100.0000000 | 42.653693 | ||||
| Epoxy Adhesive 1 | Epoxy Adhesive | Epoxy Resins | Other Epoxy resins | 0.018600 | 93.000000 | 0.016453 | |
| Organic Silicon compounds | (3,4-Epoxycyclohexyl)ethyltrimethoxysilane | 3388-04-3 | 0.000400 | 2.000000 | 0.000354 | ||
| Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.001000 | 5.000000 | 0.000885 | ||
| Subtotal | 0.020000 | 100.0000000 | 0.017691 | ||||
| Epoxy Adhesive 2 | Epoxy Adhesive | Epoxy Resins | Other Epoxy resins | 2.880900 | 99.000000 | 2.548341 | |
| Inorganic compounds | Carbon Black | 1333-86-4 | 0.029100 | 1.000000 | 0.025741 | ||
| Subtotal | 2.910000 | 100.0000000 | 2.574082 | ||||
| Epoxy Adhesive 3 | Epoxy Adhesive | Epoxy Resins | Epichlorohydrin, o-cresol, formaldehyde polymer | 29690-82-2 | 0.001500 | 5.000000 | 0.001327 |
| Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 0.004500 | 15.000000 | 0.003980 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.015000 | 50.000000 | 0.013269 | ||
| Polymers | Copolymer of ethylacrylate, buthylacrylate, acrylnitrile, glycidylmethacrylate | 58152-79-7 | 0.004500 | 15.000000 | 0.003980 | ||
| Polymers | Formaldehyde, polymer with 4,4'-(1-methylethylidene)bis[phenol] | 25085-75-0 | 0.004500 | 15.000000 | 0.003980 | ||
| Subtotal | 0.030000 | 100.0000000 | 0.026537 | ||||
| Epoxy Adhesive 4 | Epoxy Adhesive | Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.195000 | 75.000000 | 0.172490 |
| Organic compounds | Other organic compounds. | 0.003900 | 1.500000 | 0.003450 | |||
| Polymers | Plastic: EP - Epoxide, Epoxy | 0.061100 | 23.500000 | 0.054047 | |||
| Subtotal | 0.260000 | 100.0000000 | 0.229987 | ||||
| Lid | Lid | Chromium and Chromium III compounds | Chromium, metal | 7440-47-3 | 4.564217 | 19.025500 | 4.037344 |
| Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.240212 | 1.001300 | 0.212483 | ||
| Inorganic compounds | Carbon | 7440-44-0 | 0.012019 | 0.050100 | 0.010632 | ||
| Inorganic compounds | Sulfur | 7704-34-9 | 0.004798 | 0.020000 | 0.004244 | ||
| Iron and its compounds | Iron, metal | 7439-89-6 | 16.579177 | 69.108700 | 14.665349 | ||
| Manganese and its compounds | Manganese, metal | 7439-96-5 | 0.360330 | 1.502000 | 0.318735 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 2.222050 | 9.262400 | 1.965546 | ||
| Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.007197 | 0.030000 | 0.006366 | ||
| Subtotal | 23.990000 | 100.0000000 | 21.220699 | ||||
| Semiconductor Die 1 | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.588000 | 98.000000 | 0.520124 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.012000 | 2.000000 | 0.010615 | |||
| Subtotal | 0.600000 | 100.0000000 | 0.530739 | ||||
| Semiconductor Die 2 | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.607600 | 98.000000 | 0.537461 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.012400 | 2.000000 | 0.010969 | |||
| Subtotal | 0.620000 | 100.0000000 | 0.548430 | ||||
| Semiconductor Die 3 | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 6.566000 | 98.000000 | 5.808050 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.134000 | 2.000000 | 0.118532 | |||
| Subtotal | 6.700000 | 100.0000000 | 5.926581 | ||||
| Thermally Conductive Gel 1 | Thermally Conductive Gel | Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.060000 | 6.000000 | 0.053074 |
| Organic Silicon compounds | Dimethylvinylated and trimethylated silica | 68988-89-6 | 0.270000 | 27.000000 | 0.238832 | ||
| Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 0.670000 | 67.000000 | 0.592658 | ||
| Subtotal | 1.000000 | 100.0000000 | 0.884564 | ||||
| Thermally Conductive Gel 2 | Thermally Conductive Gel | Organic Silicon compounds | Dimethylvinylated and trimethylated silica | 68988-89-6 | 1.454544 | 36.363600 | 1.286638 |
| Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 2.424244 | 60.606100 | 2.144400 | ||
| Organic Silicon compounds | Tetra (trimethylsiloxy) silane | 3555-47-3 | 0.121212 | 3.030300 | 0.107220 | ||
| Subtotal | 4.000000 | 100.0000000 | 3.538257 | ||||
| Total | 113.050000 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 NTM88H135T1 Product content declaration of NTM88H135T1 | 上次修订 Last Revision (GMT): Sunday, 04 August 2024, 09:22:00 PM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||
|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | ||
| 焊丝-金 Bonding Wire - Au | 焊丝-金 Bonding Wire - Au | O | O | O | O | O | O |
| 键合线-铜钯金 Bonding Wire - CuPdAu | 键合线-铜钯金 Bonding Wire - CuPdAu | O | O | O | O | O | O |
| 铜引线框架，预镀镍钯金 Copper Lead-Frame, Pre-Plated NiPdAu | 铜引线框架，预镀镍钯金 Copper Lead-Frame, Pre-Plated NiPdAu | O | O | O | O | O | O |
| 芯片密封胶 Die Encapsulant | 芯片密封胶 Die Encapsulant | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive 1 | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive 2 | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive 3 | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive 4 | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 盖子 Lid | 盖子 Lid | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 1 | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 2 | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 3 | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| 导热凝胶 Thermally Conductive Gel 1 | 导热凝胶 Thermally Conductive Gel | O | O | O | O | O | O |
| 导热凝胶 Thermally Conductive Gel 2 | 导热凝胶 Thermally Conductive Gel | O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
| 备注： 该半导体产品具有无限期的环保使用期限（EFUP）。 |
| Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP). |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of NTM88H135T1 | Last Revision (GMT): Sunday, 04 August 2024, 09:22:00 PM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Bonding Wire - Au | Test Report 3 Jul 2024 | Test Report 3 Jul 2024 | Test Report 3 Jul 2024 | Test Report 3 Jul 2024 | |
| Bonding Wire - CuPdAu | Test Report 25 Dec 2023 | Test Report 25 Dec 2023 | Test Report 25 Dec 2023 | Test Report 25 Dec 2023 | |
| Copper Lead-Frame, Pre-Plated NiPdAu | AU PLATING | Test Report 19 Apr 2023 | Test Report 19 Apr 2023 | Test Report 19 Apr 2023 | Test Report 19 Apr 2023 |
| CDA 194 | Test Report 2 Feb 2024 | Test Report 2 Feb 2024 | Test Report 2 Feb 2024 | Test Report 2 Feb 2024 | |
| NI PLATING | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | |
| PD PLATING | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | |
| Die Encapsulant | Test Report 15 Mar 2024 | Test Report 15 Mar 2024 | Test Report 15 Mar 2024 | Test Report 15 Mar 2024 | |
| Epoxy Adhesive 1 | Test Report 28 Jul 2023 | Test Report 28 Jul 2023 | Test Report 28 Jul 2023 | Test Report 28 Jul 2023 | |
| Epoxy Adhesive 2 | Test Report 12 Dec 2023 | Test Report 12 Dec 2023 | Test Report 12 Dec 2023 | Test Report 12 Dec 2023 | |
| Epoxy Adhesive 3 | Not Available | Not Available | Not Available | Not Available | |
| Epoxy Adhesive 4 | Test Report 7 Mar 2024 | Test Report 7 Mar 2024 | Not Available | Not Available | |
| Lid | Test Report 3 Jan 2023 | Test Report 3 Jan 2023 | Test Report 3 Jan 2018 | Test Report 3 Jan 2018 | |
| Semiconductor Die 1 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
| Semiconductor Die 2 | Test Report 2 Jun 2021 | Test Report 2 Jun 2021 | Test Report 2 Jun 2021 | Test Report 2 Jun 2021 | |
| Semiconductor Die 3 | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | |
| Thermally Conductive Gel 1 | Test Report 3 May 2021 | Test Report 3 May 2021 | Test Report 3 May 2021 | Test Report 3 May 2021 | |
| Thermally Conductive Gel 2 | Test Report 3 May 2021 | Test Report 3 May 2021 | Test Report 3 May 2021 | Test Report 3 May 2021 | |
| For more information: contact us | |||||
| Note(s): |
|---|
| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |