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WESTBOROUGH, Mass. and EINDHOVEN, The Netherlands,
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A larger wafer diameter allows more semiconductor devices to be produced from a single wafer, doubling the amount of dies per wafer compared to existing 8-inch wafer formats. This increased utilization of existing materials simultaneously reduces both chemical and packaging waste and energy consumption.
The innovation is another positive step in making the manufacturing process more sustainable, while simultaneously increasing production to meet future industry demand. “We worked closely with NXP to create a solution that would truly offer a higher production output and at the same time be more sustainable,” said George Dyche, director, Global RFID Innovation and Product Line Management, Avery Dennison RFID.
The chips can also be incorporated into Avery Dennison’s SmartFaceTM Technology, which removes the plastic material in RFID products and replaces it with a paper substrate to reduce environmental impact. SmartFaceTM Technology has already been used in a number of Avery Dennison RFID Inlays and the introduction of the new wafer will reduce the environmental impact of RFID solutions further. “Sustainability has long been part of our approach to do business together. We are proud to work closely with our partners across the entire value chain to address the environmental and social impacts of our solutions,” added Helen Sahi, senior director, Sustainability, Avery Dennison.
NXP is committed to the development of sustainable products, materials and manufacturing processes for semiconductor technologies, producing tiny microchips that can perform advanced functions with extremely low power consumption.
“Bringing together both parties’ expertise, Avery Dennison and NXP introduce this innovation for more sustainability in semiconductor industry. Our collective responsibility drives us to work collaboratively to address the environmental and social impacts of our solution proactively, while the 12-inch wafers significantly increases NXP’s supply capacity,” said Ralf Kodritsch, segment manager RFID Solutions, NXP.
Businesses worldwide are recognizing the increasing value of RAIN RFID in this area. By building on innovation and providing technologies that directly address societal demands, exciting times and opportunities for the RAIN RFID industry lie ahead.
About Avery Dennison
Avery Dennison (NYSE:AVY) is a global leader in labeling and packaging materials and solutions. The company’s applications and technologies are an integral part of products used in every major market and industry. With operations in more than 50 countries and more than 25,000 employees worldwide, Avery Dennison serves customers with insights and innovations that help make brands more inspiring and the world more intelligent. Headquartered in Glendale, California, the company reported sales of $6 billion in 2015. Learn more at www.averydennison.com.
About Avery Dennison RFID
Avery Dennison Retail Branding and Information Solutions (RBIS) is a global leader in Radio Frequency Identification (RFID)-enabled solutions with more than 800 patents, and applications and global manufacturing capabilities that have produced more than 7 billion RFID tags and labels. Avery Dennison has an industry-leading solution development team that supports customers from business case development to complete solution roll-out. Based in Westborough, Massachusetts, Avery Dennison RBIS responsibly serves the global marketplace with operations in 50 countries across six continents. For more information, visit averydennison.com/RFID and follow Avery Dennison RFID on Twitter @AvyDenRFID and on LinkedIn.
NXP
Contact Avery DennisonPR: Leah Johnsonleah.johnson@averydennison.com+1 7742622373Product Marketing: Hannah BernardHannah.bernard@eu.averydennison.com+44 (0) 773 330 2973Contact NXPAmericasTate Trantate.tran@nxp.com+1 408-802-0602EuropeMartijn van der Lindenmartijn.van.der.linden@nxp.com+31 6 10914896Greater China/Asia Esther Changesther.chang@nxp.com886 2 8170 9990