Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
S32V234 quad-core Arm, 1 GHz, Security, ISO 26262 - S32V MPUs for Front/Surround View Camera, eIQ Auto
FBGA621: FBGA621, plastic, fine-pitch ball grid array; 621 balls; 0.65 mm pitch; 17 mm x 17 mm x 1.97 mm body
12NC: 935390171557
詳細
注文
パラメータ | 値 |
---|---|
ADC (bits) | 12 |
ADC (Channels) | 8 |
Junction Temperature (Min) (℃) | -40 |
Ethernet Type | 1 Gbps + IEEE 1588 + AVB |
Core: Number of cores (SPEC) | 1, 4 |
PCIe | 1 |
One Shot | GC3000 3D |
Video/Display features | ISP, MIPI-CSI-2, VIU |
GPIO | 162 |
Ethernet Type | 1 Gbps + IEEE 1588 + AVB |
Description | S32V234 quad-core Arm, 1 GHz, Security, ISO 26262 - S32V MPUs for Front/Surround View Camera, eIQ Auto |
Safety Level | up to ASIL B |
Free Programmable CPU | Arm Cortex-A53, Arm Cortex-M4 |
Supply Voltage [Min - Max] | 0.95, 1.05 |
ADC | 8 |
Operating Frequency [Max] (MHz) | 1000 |
ADC COUNT CLOUD | 8 |
Frequency (Max) (kHz) | 1000000 |
Supply Voltage [max] (V) | 1.05 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
Supply Voltage [min] (V) | 0.95 |
External Memory Supported | DDR3 SDRAM, LPDDR2 DRAM, QSPI, uSDHC |
Peripherals | ADC, CAN-FD, ETH, I²C, PCIe 2.0, SPI, UART |
Memory Size (B) | 4096000 |
NFTX/BT (dB) (Typ) | GC3000 3D |
Supply Voltage [Min to Max] (V) | 0.95 to 1.05 |
Peripheral Type | ADC, CAN-FD, ETH, I²C, PCIe 2.0, SPI, UART |
ADC (bits) | 12 |
PCIe | 1 x PCIe 2.0 |
Ethernet w/ 1588 | 1 |
Special Features | GC3000 3D |
AEC-Q100 Temperature Range | grade 2 |
Serial Communication | 1 x PCIe 2.0, 2 x UART, 3 x I²C, 3 x SPI |
ADC [Number, bits] | 8 x 12 |
Core Type | 1 x Arm Cortex-M4, 4 x Arm Cortex-A53 |
Number of pins | 621 |
Package Style | FBGA |
Peripheral Type | ADC, CAN-FD, ETH, I²C, PCIe 2.0, SPI, UART |
SRAM (Bytes) | 4096000 |
eTSEC | 20 |
TDM | 20 |
パラメータ | 値 |
---|---|
External Memory Interface | 1 x uSDHC, 2 x DDR3 SDRAM, 2 x LPDDR2 DRAM, 2 x QSPI |
I2C | 3 |
J1850 | 20 |
SLIC | 20 |
Tvj [max] (℃) | 125 |
Security Status | COMPANY PUBLIC |
SPI | 3 |
Low Leakage | N |
Details | GC3000 3D |
CAN FD | 2 |
Operating Voltage [Min to Max] (V) | 0.95 to 1.05 |
Memory | SRAM |
Core Type | Arm Cortex-A has child A35, A53, Arm Cortex-M has child M3, M33, M4, M4F |
ADC Resolution | 12 |
Internal Memory Supported | SRAM |
Accuracy on-chip (±°C) | GC3000 3D |
Features | GC3000 3D |
IBIZ LOADER | Arm Cortex-A53, Arm Cortex-M4 |
CLOUD_PROD3_NXP_CLOCK_SPEED_MAX | 1000 |
UART | 2 |
Security Modules | CSE3 |
Pad supply (V) | 0.95 to 1.05 |
Junction Temperature (Max) (℃) | 125 |
Junction Temperature (Min to Max) (℃) | -40 to 125 |
CLOUD_PROD2_NXP_CLOCK_SPEED_MAX | 1000 |
ASIL Certification | up to ASIL B |
Communication protocol | ADC, CAN-FD, ETH, I²C, PCIe 2.0, SPI, UART |
CLOUD PROD - Operating Frequency [Max] (MHz) | 1000 |
SRAM (kB) | 4096 |
Core Type | Arm Cortex-A53, Arm Cortex-M4 |
GPU 2D / GPU 3D | GC3000 3D |
Operating Temperature (Min-Max) (℃) | -40 to 105 |
Camera Interfaces | 1 x ISP, 2 x MIPI-CSI-2, 2 x VIU |
Arm Core | Arm Cortex-A53, Arm Cortex-M4 |
Ethernet | 1 |
Independent ADC Modules | 8 |
Human Machine Interface | system integration unit lite |
Ethernet | 1 x 1 Gbps + IEEE 1588 + AVB |
Master Interface | ADC, CAN-FD, ETH, I²C, PCIe 2.0, SPI, UART |
Controller Interface | ADC, CAN-FD, ETH, I²C, PCIe 2.0, SPI, UART |
Operating Frequency [Max] (MHz) | 1000 |
Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | REACH SVHC | Weight (mg) |
---|---|---|---|---|---|---|
FS32V234CTN1VUB(935390171557) | Yes | Yes Certificate Of Analysis (CoA) | Yes | REACH SVHC | 2153.4 |
Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
鉛フリーはんだ | 鉛フリーはんだ | 鉛フリーはんだ | |||||
FS32V234CTN1VUB (935390171557) | ISO 26262 | 3 | 260 | 40 |
Part/12NC | 関税分類番号(米国)免責事項: | 輸出規制品目番号(米国) | CCATS |
---|---|---|---|
FS32V234CTN1VUB (935390171557) | 854231 | 5A992C | G161530 |
Part/12NC | 発行日 | 有効期限 | PCN | タイトル |
---|---|---|---|---|
FS32V234CTN1VUB (935390171557) | 2022-11-23 | 2022-11-24 | 202211005I | S32V234 Reference Manual update from Rev5.1 to Rev6 |
FS32V234CTN1VUB (935390171557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
The S32V234 is a second-generation vision processor family and member of the 64-bit Arm® Cortex®-A53 S32V processors. The S32V234 processor offers an image signal processor (ISP), a powerful 3D graphic processor unit (GPU), dual APEX-2 vision accelerators, automotive-grade reliability, functional safety and security capabilities.
S32V234 processors support computation-intensive ADAS, New Car Assessment Program (NCAP) front camera, object detection and recognition, surround view and automotive and industrial image processing; also, machine learning (ML) and sensor fusion applications.
The S32V234 processor has comprehensive enablement supported by S32 Design Studio IDE for Vision, including a compiler, debugger, Vision SDK, Linux BSP and graph tools.