Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
NXP 32-bit MCU, Power Arch core, 1MB Flash, 66MHz, -40/+105degC, Automotive Grade, QFP 144
LQFP144: LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body
12NC: 935310043557
詳細
注文
12NC: 935310043528
詳細
注文
パラメータ | 値 |
---|---|
Flash (kB) | 1000 |
RAM (kB) | 64 |
Core Type | e200 |
Core: Number of cores (SPEC) | 2 |
Operating Frequency [Max] (MHz) | 66 |
CAN | 5 |
パラメータ | 値 |
---|---|
I2C | 1 |
SPI | 4 |
GPIO | 111 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
Supply Voltage [min] (V) | 4.5 |
Supply Voltage [max] (V) | 5.25 |
Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | 2次インターコネクト | REACH SVHC | Weight (mg) |
---|---|---|---|---|---|---|---|
SPC5516EAVLQ66(935310043557) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 1319.1 | |
SPC5516EAVLQ66R(935310043528) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 1319.1 |
Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
鉛フリーはんだ | 鉛フリーはんだ | 鉛フリーはんだ | |||||
SPC5516EAVLQ66 (935310043557) | No | 3 | 260 | 40 | |||
SPC5516EAVLQ66R (935310043528) | No | 3 | 260 | 40 |
Part/12NC | 関税分類番号(米国)免責事項: | 輸出規制品目番号(米国) |
---|---|---|
SPC5516EAVLQ66 (935310043557) | 854231 | 3A991A2 |
SPC5516EAVLQ66R (935310043528) | 854231 | 3A991A2 |
Part/12NC | 発行日 | 有効期限 | PCN | タイトル |
---|---|---|---|---|
SPC5516EAVLQ66 (935310043557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
SPC5516EAVLQ66R (935310043528) |
Designed for body electronics, the NXP® MPC5510 MCU belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle.