SPC5517GAMLQ66 製品情報|NXP

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SPC5517GAMLQ66

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SPC5517GAMLQ66

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特徴

NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 66MHz, -40/+125degC, Automotive Grade, QFP 144

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パッケージ

LQFP144: LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body

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操作機能

パラメータ値
Security Status
COMPANY PUBLIC
Description
NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 66MHz, -40/+125degC, Automotive Grade, QFP 144
パラメータ値
Number of pins
144
Package Style
LQFP

環境

Part/12NC鉛フリーEU RoHSハロゲンフリーRHFインジケーター2次インターコネクトREACH SVHCWeight (mg)
SPC5517GAMLQ66R(935310431528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
1319.1

品質

Part/12NC安全保障機能安全吸湿感度レベル (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
鉛フリーはんだ鉛フリーはんだ鉛フリーはんだ
SPC5517GAMLQ66R
(935310431528)
No
3
260
40

配送

Part/12NC関税分類番号（米国)免責事項:輸出規制品目番号（米国）
SPC5517GAMLQ66R
(935310431528)
854231
3A991A2

製品変更のお知らせ

Part/12NC発行日有効期限PCNタイトル
SPC5517GAMLQ66R
(935310431528)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

詳細 MPC5510

Designed for body electronics, the NXP MPC5510 MCU belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle.

  • Offers high-performance while continuing to meet low-power requirements
  • Enables centralized architectures, which reduce the number of distributed ECUs and complexity of vehicle architectures
  • Provides extensive communication capabilities (e.g., FlexRay, multiple CAN and LIN support)
  • Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flash
  • Backed by a third-party ecosystem of development tools and software
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