Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
HSOP54: HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.33 mm body
12NC: 935310373574
詳細
注文
12NC: 935310373518
詳細
注文
パラメータ | 値 |
---|---|
Security Status | COMPANY PUBLIC |
Description | 3.3V SBC HSCAN DUAL LIN |
パラメータ | 値 |
---|---|
Number of pins | 54 |
Package Style | HSOP |
Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | 2次インターコネクト | REACH SVHC | Weight (mg) |
---|---|---|---|---|---|---|---|
MCZ33905BD3EK(935310373574) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 766.15 | |
MCZ33905BD3EKR2(935310373518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | e3 | REACH SVHC | 766.15 |
Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
---|---|---|---|---|---|---|---|
鉛フリーはんだ | 鉛フリーはんだ | 鉛フリーはんだ | |||||
MCZ33905BD3EK (935310373574) | No | 3 | 260 | 40 | |||
MCZ33905BD3EKR2 (935310373518) | No | 3 | 260 | 40 |
Part/12NC | 関税分類番号(米国)免責事項: | 輸出規制品目番号(米国) |
---|---|---|
MCZ33905BD3EK (935310373574) | 854239 | EAR99 |
MCZ33905BD3EKR2 (935310373518) | 854239 | EAR99 |
Part/12NC | 製造終了のお知らせ | 最終購入日 | 最終納品日 |
---|---|---|---|
MCZ33905BD3EK (935310373574) | - | 2013-02-16 | 2014-02-16 |
MCZ33905BD3EKR2 (935310373518) | - | 2013-02-16 | 2014-02-16 |
Part/12NC | 発行日 | 有効期限 | PCN | タイトル |
---|---|---|---|---|
MCZ33905BD3EK (935310373574) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCZ33905BD3EKR2 (935310373518) | ||||
MCZ33905BD3EK (935310373574) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
The NXP MC33905 is part of a second generation family of system basis chips, combining multiple features and enhanced module design.