Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
特徴
Kinetis® K20-50 MHz, Full-Speed USB, Mixed-Signal Integration Microcontrollers based on Arm® Cortex®-M4 Core
パッケージ
LFBGA64: LFBGA64, plastic, low profile fine-pitch ball grid array; 64 bumps; 0.5 mm pitch; 5 mm x 5 mm x 1.23 mm body
購入オプション
MK20DX128VMP5
アクティブ
12NC: 935317593557
詳細
操作機能
| パラメータ | 値 |
|---|---|
Core Type | Arm Cortex-M4 |
Operating Frequency [Max] (MHz) | 50 |
SRAM (kB) | 16 |
Flash (kB) | 160 |
EEPROM (kB) | 0.002 |
UART | 3 |
SPI | 1 |
I2C | 1 |
| パラメータ | 値 |
|---|---|
USB Controllers | 1 |
GPIO | 40 |
ADC (16 bit) | 1 |
16-bit PWM | 10 |
Security | CRC |
Supply Voltage [min] (V) | 1.71 |
Supply Voltage [max] (V) | 3.6 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
環境
| Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | 2次インターコネクト | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MK20DX128VMP5(935317593557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e1 | REACH SVHC | 64.8 |
品質
| Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 鉛フリーはんだ | 鉛フリーはんだ | 鉛フリーはんだ | |||||
MK20DX128VMP5 (935317593557) | No | 3 | 260 | 40 | |||
配送
| Part/12NC | 関税分類番号（米国)免責事項: | 輸出規制品目番号（米国） |
|---|---|---|
MK20DX128VMP5 (935317593557) | 854231 | 3A991A2 |
製品変更のお知らせ
| Part/12NC | 発行日 | 有効期限 | PCN | タイトル |
|---|---|---|---|---|
MK20DX128VMP5 (935317593557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MK20DX128VMP5 (935317593557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
詳細 K20_50
- Includes a rich suite of analog, communication, timing and control peripherals to accommodate a wide range of requirements
- Maximizes board space and enhances performance with minimum-length interconnections
- Provides performance efficiency with low power
- Delivers significant BOM savings through smart on-chip integration
- Shares the comprehensive enablement and scalability of the Kinetis® portfolio