Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
特徴
Kinetis® K22-120 MHz, Cost Effective, Full-Speed USB Microcontrollers (MCUs) based on Arm® Cortex®-M4 Core
パッケージ
XFBGA121: XFBGA121, plastic, extremely thin fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 0.43 mm body
購入オプション
MK22FN256VDC12
アクティブ
12NC: 935318267557
詳細
数量
単価
| 1 - 25 | $6.23 |
| 26 - 99 | $5.75 |
| 100+ | $5.27 |
注文
在庫あり:1,740
代理店からの注文操作機能
| パラメータ | 値 |
|---|---|
Core Type | Arm Cortex-M4 |
Operating Frequency [Max] (MHz) | 120 |
SRAM (kB) | 48 |
Flash (kB) | 256 |
UART | 4 |
SPI | 2 |
I2C | 2 |
USB Controllers | 1 |
| パラメータ | 値 |
|---|---|
GPIO | 70 |
ADC (16 bit) | 2 |
16-bit PWM | 12 |
Security | CRC, RNG |
Supply Voltage [min] (V) | 1.71 |
Supply Voltage [max] (V) | 3.6 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
環境
| Part/12NC | 鉛フリー | EU RoHS | ハロゲンフリー | RHFインジケーター | 2次インターコネクト | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MK22FN256VDC12(935318267557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e1 | REACH SVHC | 53.9 |
品質
| Part/12NC | 安全保障機能安全 | 吸湿感度レベル (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 鉛フリーはんだ | 鉛フリーはんだ | 鉛フリーはんだ | |||||
MK22FN256VDC12 (935318267557) | No | 3 | 260 | 40 | |||
配送
| Part/12NC | 関税分類番号（米国)免責事項: | 輸出規制品目番号（米国） |
|---|---|---|
MK22FN256VDC12 (935318267557) | 854231 | 3A991A2 |
製品変更のお知らせ
| Part/12NC | 発行日 | 有効期限 | PCN | タイトル |
|---|---|---|---|---|
MK22FN256VDC12 (935318267557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MK22FN256VDC12 (935318267557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
詳細 K22_120
Kinetis® K22 MCUs have been optimized for cost-sensitive applications requiring low power flexibility and processing efficiency.
- Delivers optimized low power while providing significant bill-of-materials savings through smart on-chip integration
- Includes options that support crystal-less USB design for reduced system cost and board space
- Provides scalability with various levels of integration, offering a rich suite of analog, communication, timing and control peripherals to accommodate a wide range of requirements
- Shares the comprehensive enablement and scalability of the Kinetis portfolio